Weebit Nano announced the successful completion of an approximately US$40 million fund raising through the placements of twelve million new shares to international institutional investors, as well as an oversubscribed share purchase plan (SPP) to existing shareholders.
Packaging
Quantum-Si Bolsters Executive Leadership Team with Four Key Appointments
These appointments follow the commercial launch of Platinum, the world’s first next-generation, single-molecule protein sequencing platform, and will support Quantum-Si’s growing customer base and further scaling of the company.
GaN and SiC Technologies on Spotlight at PowerUP Asia Conference
The power GaN market will be worth $2 billion in 2027, with consumer applications, including power supplies and Class D audio amplifiers, representing about 48% of the total GaN industry.
Global PC Shipments Plunged 30% Year-over-Year to 56.9M Units in Q1 2023
Over the past years, global PC and laptop ownership and usage have significantly decreased, mainly replaced by smartphones.
Synopsys, TSMC and Ansys Strengthen Ecosystem Collaboration to Advance Multi-Die Systems
Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. has strengthened its collaboration with TSMC and Ansys for multi-die system design and manufacturing.
Microchip Technology Announces Promotion of Rich Simoncic to Executive Vice President
Microchip Technology Inc., a provider of smart, connected and secure embedded control solutions, today announced that its board of directors has promoted Rich Simoncic to Executive Vice President of Microchip.
EMCORE Announces Restructuring Program
EMCORE Corporation today announced a restructuring program that includes the shutdown of the Broadband business segment and the discontinuance of its defense optoelectronics product line.
SEMI Europe Applauds Provisional Agreement Reached in EU Chips Act Trilogue Negotiations
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the provisional agreement reached yesterday in the European Chips Act Trilogue Negotiations to invest €43 billion to bolster Europe’s microelectronics industry.
Marvell Demonstrates Industry’s First 3nm Data Infrastructure Silicon
Marvell Technology, Inc. has demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on Taiwan Semiconductor Manufacturing Company’s (TSMC) 3-nanometer (3nm) process.
SK hynix Develops Industry’s First 12-Layer HBM3
SK hynix Inc. announced today it has become the industry’s first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers’ performance evaluation of samples is underway.
