SIA-BCG study calls for new federal funds to be directed at five key areas of semiconductor R&D.
Packaging
Cadence’s New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies
Cadence Design Systems, Inc.collaborated with TSMC to develop a node-to-node design migration flow built upon the Cadence Virtuoso design platform for custom/analog IC blocks that use TSMC’s advanced process technologies.
Synopsys Collaborates with TSMC
Addressing complex customer requirements for heterogeneous compute-intensive applications, Synopsys, Inc. today announced the availability of the industry’s most comprehensive EDA and IP solutions for 2D/2.5D/3D multi-die systems for TSMC’s most advanced N7, N5 and N3 process technologies.
Alchip Technologies Joins UCIe Consortium
Alchip Technologies has joined the UCIe (Universal Chiplet Interconnect Express) Consortium at the contributor level, reinforcing its position as the high-performance ASIC leader.
Worldwide Silicon Wafer Shipments Set a New Record in Q3 2022, SEMI Reports
Worldwide silicon wafer shipments reached a new record of 3,741 million square inches (MSI) in the third quarter of 2022, increasing 1.0% quarter-over-quarter and growing 2.5% from the 3,649 MSI recorded during the same quarter last year.
Supplyframe and Jabil Indicate Limited Relief for the Electronics Supply Chain
Industry leaders make meaning out of mixed signals, myriad disruptions to illuminate the best path forward.
CHIPS Act Incentives: “Additional Considerations”
Sree Ramaswamy, Senior Policy Advisor to U.S. Secretary of Commerce, detailed the “additional considerations” that will be used to determine which applicants receive funding through the CHIPS Act.
KLA Launches New Double-Sided Direct Imaging Platform Supporting Continued Innovation for PCBs and IC Substrates
Today KLA Corporation introduced the new Orbotech Corus 8M direct imaging (DI) solution, the first system built on the all-in-one revolutionary Orbotech Corus platform, combining the functionality and automation of an entire direct imaging production line in a closed, clean and compact unit.
Synopsys Advances Designs on TSMC N3E Process with Production-Proven EDA Flows and Broadest IP Portfolio for AI, Mobile and HPC Applications
Building on a long-standing collaboration with TSMC to drive continued innovation on advanced process nodes, Synopsys, Inc. today announced several key achievements on the TSMC N3E process technology.
UMC Receives “Best Foundry” Honor from Infineon
The award was presented to UMC during Infineon’s 2022 Global Supplier Day, which took place in Kuala Lumpur on October 13.
