Semiconductor leaders and visionaries will gather to provide insights into the latest industry developments and innovations during a three-monthSEMICON Taiwan 2021 experience starting with five live online forums in September and culminating in the on-site exhibition December 28-30 at the Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).
Packaging
TESCAN Announces UniTOM HR
UniTOM HR is a single solution that provides insight to a sample’s internal structure as well as its behavior under environmental conditions over time.
JCET 1H 2021 Net Profit Jumps 261%, Earnings Surpass FY 2020 Mark
According to the financial report, in 1H 2021, JCET maintained its momentum of growth and strong profitability, with revenue of RMB 13.82 billion and net profit of RMB 1.32 billion, which achieved 15.4% and 261.0% year on year growth respectively.
Researchers Just Developed New High-Performance Flexible Electronics
The manufacturing technique invented by the Stanford team makes it possible to create flexible and atomically thin transistors that are several times smaller than previous efforts.
Rambus Completes Acquisition of PLDA
Rambus Inc., a provider of chips and silicon IP making data faster and safer, today announced the completion of the acquisition of PLDA.
GlobalFoundries Sets “Journey to Zero Carbon” Goal to Reduce Greenhouse Gas Emissions by 25% while Expanding Global Manufacturing Capacity
GlobalFoundries today announced its goal to reduce greenhouse gas emissions by 25% from 2020 to 2030, as the company expands its global manufacturing capacity.
QP Technologies Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
QP Technologies (formerly Quik-Pak), a provider of microelectronic packaging and assembly solutions, today announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility.
2021 IEEE International Electron Devices Meeting Highlights Educational Opportunities in Leading-Edge Semiconductor Technologies
While the comprehensive technical program for the 2021 IEEE International Electron Devices Meeting (IEDM) will…
A Holistic Approach to Materials for the Next Generation of Electrical Insulation
Researchers from The University of Texas at Austin in collaboration with the U.S. Army Research Lab are analyzing new materials for electrical insulation, or packaging, that can remove heat more effectively compared to today’s insulation, amid a need to redesign our electrical infrastructure for the next 100 years and beyond to match advanced technology.
IAR Systems Collaborates with NSITEXE
IAR Systems, the future-proof supplier of software tools and services for embedded development, today announced its partnership with NSITEXE.
