Renesas Electronics Corporation today launched a new line of plastic-packaged radiation-hardened (rad-hard) devices for satellite power management systems.
Packaging
SkyWater Successfully Launches MPW Shuttle for 90nm Strategic Rad-Hard by Process Platform
SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the launch of its first Early Access Program multi-project wafer shuttle for the company’s 90nm Strategic Rad-Hard by Process platform.
Semiconductor Equipment Forecast to Post Industry High of $100 Billion in 2022, SEMI Reports
Global sales of semiconductor manufacturing equipment by original equipment manufacturers are forecast to surpass $100 billion next year, a new high, after jumping 34% to $95.3 billion in 2021 compared to $71.1 billion in 2020.
Mass Production of 14nm Chips in China Will Spur Future Growth of Its Chip Industry
Total Telecom reports that China is steadily moving towards achieving its goal of mass-producing 14nm chips next year.
Integra Technologies Launches Industry First 100V RF GaN/SiC Technology for Mission-Critical Defense Applications
Integra’s first 100V RF GaN product, the IGN1011S3600, delivers breakthrough output power performance of 3.6 kiloWatts at 70% efficiency for next generation avionic systems.
CAES Expands Apprentice Offerings to Silicon Valley
CAES, a provider of mission critical electronic solutions, is excited to announce that it has established an apprenticeship program in San Jose, California to further enhance Silicon Valley’s manufacturing workforce and to secure a highly skilled pipeline for technical talent.
Mouser Named e-Catalog Distributor of the Year by Molex for Americas, Asia and Europe
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, announced that it has received 2020 Americas e-Catalog Distributor of the Year, APS e-Catalog Distributor of the Year, and European e-Catalog Distributor of the Year honors from Molex.
Mid-Year Forecasts to Provide Global Chip Industry Insights
Annual mid-year semiconductor equipment, materials, fab capacity and economic forecasts will provide timely insights.
3D Stacking Paves Way for Smaller, Power-Packed Computing Chips
Scientists from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) have developed breakthrough technology that can stack up to four layers of wafers, potentially decreasing the cost of production by 50 per cent.
A*STAR’s Institute of Microelectronics Teams with Major Industry Players in High Density System-in-Package Consortium for Heterogenous Chiplets Integration
The newly formed consortium will leverage IME’s expertise in FOWLP/2.5D/3D packaging.
