Gel-Pak, a division of Delphon and a manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries announces its collaboration with BAE Systems on a new product called the Lid/Clip Super System (LCS2).
Packaging
Akoustis Locks Process Flow for Second Wafer Level Package for XBAW Filters
Akoustis Technologies, Inc., an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has locked the process flow for its second chip scale package (CSP).
GLOBALFOUNDRIES Moves Corporate Headquarters to its Most Advanced Semiconductor Manufacturing Facility in New York
GLOBALFOUNDRIES announced at an onsite event with Senate Majority Leader Chuck Schumer that it will relocate its headquarters to Malta, New York, the site of Fab 8, the company’s most advanced semiconductor manufacturing facility — as the company positions itself for growth, strengthens partnerships with customers and recruits new talent.
A Silver Lining for Extreme Electronics
Tomorrow’s cutting-edge technology will need electronics that can tolerate extreme conditions. That’s why a group of researchers led by Michigan State University’s Jason Nicholas is building stronger circuits today.
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of SiC MOS Devices
JEDEC Solid State Technology Association announces the publication of JEP184: Guideline for evaluating Bias Temperature Instability of Silicon Carbide Metal-Oxide-Semiconductor (MOS) Devices for Power Electronic Conversion.
SiFive and Samsung Foundry Extend Partnership to Accelerate AI SoC Development
The extended partnership will enable and accelerate the development of Artificial Intelligence and Machine Learning inference and training SoCs based on SiFive RISC-V processors and built using Samsung Foundry technology infrastructure.
Silicon Chip Will Drive Next Generation Communications
A new design of ultra-small silicon chip called a multiplexer will effectively manage terahertz waves which are key to the next generation of communications: 6G and beyond.
FormFactor, Inc. Reports 2021 First Quarter Results
FormFactor, Inc. today announced its financial results for the first quarter of fiscal 2021 ended March 27, 2021.
Fabless Suppliers Held a Record 33% of the 2020 IC Market
Fabless IC suppliers registered a strong 24% surge in sales last year as compared to only an 8% increase by the IDMs.
Semtech Unveils LoRa Corecell Reference Design for Full Duplex Gateway Applications
Semtech Corporation today announced the launch of a new product in its LoRa Core portfolio, the LoRa Corecell Reference Design for full duplex gateway applications in the U.S. 902 – 928MHz ISM band.
