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Automotive LiDAR Market Growth Sturdy at 30.4% CAGR to Outstrip $4,348.09 Million by 2027

The Automotive LiDAR Market Size was valued at US$ 521.35 million in 2019 and is projected to reach US$ 4,348.09 million by 2027; it is expected to grow at a CAGR of 30.4% during 2019–2027.

Silicon Integration Initiative Targets New Silicon Carbide Standard SPICE Model

The Si2 Compact Model Coalition has voted to fund and standardize a SPICE model for silicon carbide-based metal-on-silicon field-effect transistors.

Akoustis Announces Issuance of Nine New Patents

Akoustis Technologies, Inc. announced the issuance of nine new patents related to its innovative BAW resonators, piezoelectric materials, XBAW manufacturing process, wide-bandwidth RF filters and its applications in 5G mobile and other wireless devices.

SIA Echoes National Security Leaders’ Call for Federal Investments in Chip Technology

The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer in support of a recent letter from top national security leaders to President Biden urging enactment of legislation to strengthen America’s technological edge.

KBR Wins $48.5M U.S. Air Force Task Order for Optoelectronic Technology Research

KBR won a $48.5 million recompete to support optoelectronic technology research for the U.S Air Force Research Laboratory Sensors Directorate’s Optoelectronic Technology Branch (RYDH).

Brooks Announces Agreement to Acquire Precise Automation

Brooks Automation, Inc. today announced that it has entered a definitive agreement to acquire Precise Automation, Inc.

New Alloy Can Directly Reduce the Weight of Heat Removal Systems by a Third

The new alloys created by NUST MISIS scientists in cooperation with LG Electronics will help reduce the weight of radiators and heat removal systems in electric vehicles and consumer electronics by one third.

Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm

Rambus Inc. announced the Rambus HBM2E memory interface subsystem, consisting of a fully-integrated PHY and controller, is silicon proven on Samsung’s advanced 14/11nm FinFET process.

Quantum-Si Announces Appointment of Claudia Napal Drayton as Chief Financial Officer

Quantum-Si Incorporated, a pioneer in next-generation semiconductor chip-based proteomics, announced today the appointment of Claudia Napal Drayton as Chief Financial Officer.

DeepCube Acquired by Nano Dimension

DeepCube has signed a definitive agreement to be acquired by Nano Dimension Ltd.

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