pSemi Corporation, a Murata company focused on semiconductor integration, announces the opening of a new design center in Chennai, India to support the company’s growing demand for semiconductor products enabling 5G and Internet-of-Things (IoT) applications.
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EMD Performance Materials Announces Further Investments of Electronics Business and New Name: EMD Electronics
EMD Performance Materials today announced an expanded focus on the US electronics business and a new name in the US: EMD Electronics.
Intel to Collaborate with Microsoft on DARPA Program
Intel today announced that it has signed an agreement with Defense Advanced Research Projects Agency (DARPA) to perform in its Data Protection in Virtual Environments (DPRIVE) program.
Lithium-ion Battery Market Size Worth $83.36 Billion by 2027
The global lithium-ion battery market size is expected to reach USD 83.36 billion by 2027 according to a new study by Polaris Market Research.
Bosch Reaches Milestone on the Way to Opening New Wafer Fab in Dresden
It is a milestone on the path to the chip factory of the future: at the new Bosch semiconductor fab in Dresden, silicon wafers are passing through the fully automated fabrication process for the first time.
Busch Vacuum Solutions USA Acquires Long-Term Sales Channel Partner
Busch Vacuum Solutions USA, one of the largest manufacturers of vacuum pumps, blowers, compressors and systems, announces the acquisition of Jennings Associates Inc. (dba Jennings Alberts Inc) a distributor for new equipment, maintenance, and repair for vacuum pumps blowers and heat exchangers.
Teledyne e2v HiRel and Integra Technologies Inc. Partner on High Voltage GaN Devices
Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra).
Samsung Begins Mass Production of Data Center SSD Customized for Hyperscale Environments
Samsung Electronics Co. announced that it has begun mass producing its most advanced line of data center SSDs, the PM9A3 E1.S.
DELO and Infotech Collaborate on 3D Printing System for Multi-material Designs
DELO has collaborated with Infotech, a Swiss-based company that recently introduced a unique and fully-automated system designed specifically for printing liquid materials and multi-material structures, to help with the production of components with different physical property ranges.
SEMI Applauds President Biden, Bipartisan Congressional Leaders for Supporting Semiconductor Supply Chain Incentives
SEMI today released the following statement from president and CEO Ajit Manocha on the support of funding incentives to expand U.S. semiconductor manufacturing and research by President Biden and a bipartisan group of members of Congress in a meeting at the White House on February 24, 2021.
