Infinitesima Ltd announced the shipment of the first RPM 3D system to jointly develop 3-dimensional metrology applications for characterisation of semiconductor devices in collaboration with imec.
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Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM.
SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and Sustainability in Spotlight
SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry can enable a secure and sustainable digital future.
European SEMI Award Honors KU Leuven, TU Dresden and CEA-Leti for Key Chip Industry Contributions
The Catholic University of Leuven, Technical University of Dresden and CEA-Leti have won the 2019 European SEMI Award at the SEMI Technology Unites Global Summit for their pivotal contributions in the fields of telecommunications and nanotechnology.
Thermo Scientific Helios 5 PXL PFIB Wafer DualBeam Enables Inline Metrology of Advanced 3D Structures
Thermo Fisher Scientific, the world leader in serving science, today launched the Thermo Scientific Helios 5 PXL PFIB Wafer DualBeam. The system, a plasma focused ion beam scanning electron microscope, reduces time-to-data from days to hours for inline through-stack metrology and verification of high-aspect ratio structures.
A Performance Leap for Graphene Modulators In Next Generation Datacom and Telecom
Over the past years, global data traffic has experienced a boom, with over 12.5 billion connected devices all over the world. The current world-wide deployment of the 5G telecommunications standard is triggering the need for smaller devices with enhanced performances, such as higher speed, lower power consumption and reduced cost as well as easier manufacturability.
Court Dismisses ROHM Semiconductor USA’s Lawsuit for Declaratory Judgment of Noninfringement of MaxPower Semiconductor’s Patents and Compels Arbitration
MaxPower Semiconductor, Inc. (MaxPower), provider of high-performance power semiconductor products, today announced that, following a hearing on February 4, 2021, the U. S. District Court for the Northern District of California dismissed ROHM Semiconductor USA LLC (ROHM USA)’s complaint for declaratory judgment of noninfringement of MaxPower’s patents.
U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, today announced a strategic partnership with the U.S. Department of Defense (DoD) to provide a secure and reliable supply of semiconductor solutions manufactured at GF’s Fab 8 in Malta, New York.
Semiconductor Industry Leaders Urge President Biden to Prioritize Funding for Semiconductor Manufacturing, Research
The Semiconductor Industry Association (SIA) Board of Directors, comprised of CEOs and senior executives at leading U.S. chip companies, today sent a letter to President Biden urging him to include substantial funding for semiconductor manufacturing and research in the administration’s economic recovery and infrastructure plan.
Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%
Foundries and memory IC suppliers maintain strongest capacity presence.
