CyberOptics Corporation will feature the WX3000 metrology and inspection system with Multi-Reflection Suppression™ (MRS) sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the Virtual SEMI Technology Unites Global Summit from February 15-19th.
Packaging
Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance Computing SoCs
Synopsys, Inc. today announced the silicon proof of DesignWare 112G Ethernet PHY IP in 5nm FinFET process, delivering significant performance, power and area advantages.
Top-10 IC Growth Categories Target Emerging Applications in 2021
IC Insights recently released its 2021 edition of The McClean Report. The new analysis and forecast of the IC industry includes IC Insights’ ranking of IC categories based on sales growth rate.
Lam Research Advances Next Generation 3D Memory Manufacturing with Revolutionary New Etch Technology
Lam Research Corp. today announced Vantex, the latest in dielectric etch technology designed specifically for Sense.i, the most intelligent etch platform available today.
D2S Unleashes the Petaflops Computing Era for Semiconductor Manufacturing
D2S, a supplier of GPU-accelerated solutions for semiconductor manufacturing, today introduced the seventh generation of its computational design platform (CDP), a scalable processing solution for simulation-based semiconductor design and manufacturing applications.
Process Technology Unveils the SHX Family of Products
Process Technology, a leading manufacturer of inline, ultra-high purity heaters for the semiconductor industry, is excited to announce its new family of SHX and SHX-EX heaters for IPA and flammable solvents.
JEDEC Wide Bandgap Power Semiconductor Committee Publishes New Test Method for Continuous-Switching Evaluation of GaN Power Conversion Devices
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announces the publication of JEP182: Test Method for Continuous-Switching Evaluation of Gallium Nitride Power Conversion Devices.
Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest breakthrough in edge computing from Flex LogixÒ for demanding Artificial Intelligence (AI) applications such as object recognition.
EdgeQ Adds Former Qualcomm CEO Paul Jacobs & CTO Matt Grob as Advisors to Disrupt the Current Closed RAN Ecosystem with RISC-V based Highly Programmable 5G and AI Platform
EdgeQ Inc, a 5G systems-on-a-chip company, announced today that Dr. Paul Jacobs and Matt Grob have joined the advisory board.
Micron Delivers Industry’s First 1α DRAM Technology
Micron Technology today announced volume shipment of 1α (1-alpha) node DRAM products built using the world’s most advanced DRAM process technology and offering major improvements in bit density, power and performance.
