As we look toward 2025, one trend we observe gaining momentum is the increased adoption of GEM300 standards for wafer sizes smaller than 300mm.
Packaging
2025: Sustainability and Photonics
For managing the energy needed for data processing, a key future technology will be silicon photonics, which enables seamless integration of optical components like waveguides, switches, and modulators with electronic circuits on a single silicon chip.
2025: MEMS Move to 300mm
The move to 300mm wafers as a substantial leap forward for the MEMS industry in manufacturing automation and cost-effectiveness, yet many challenges remain.
2025: Optimizing Automated Test Equipment for the Era of AI and Beyond
The role of advanced ATE systems will become even more critical; smaller geometries increase test sensitivity requirements, demanding ATE systems with higher precision and accuracy.
2025: Advancements in Litho Technologies Enabling Next-Generation Multi-Chip Systems
As advanced packing gains momentum, the industry will be looking to novel, creative processing solutions to handle the integration imperatives of today – and tomorrow.
2025: New Packaging Approaches Drive Cost and Efficiency
The fast adoption of chiplets will continue to drive wafer-level packaging (WLP) growth in 2025, as semiconductor companies continue to invest in various types of packages for diverse applications.
2025: Opportunities Abound for Semiconductor Equipment
As we look ahead to 2025, we’re seeing three major trends: a growing compound semiconductor market, the resurgence of wet bench technology and growing workforce development needs.
2025: A Paradigm Shift in Wire Interconnection
The drive towards high density (HD), ultra-high density (UHD) and alternative substrates, including glass, will be transformative for North American wire interconnection manufacturing in 2025.
2025: The Future of Flex Is Here
A rapidly accelerating trend is the proliferation of complex assembly directly onto flexible substrates.
Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
