Growing emphasis on quantum sensor commercialization, particularly in North America’s medical sector, is driving increased demand and creating lucrative market prospects for device suppliers.
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ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM
The Industrial Technology Research Institute (ITRI) has joined forces with Taiwan Semiconductor Manufacturing Company (TSMC) for pioneering research into the development of a spin-orbit-torque magnetic random-access memory (SOT-MRAM) array chip.
Chiplets Market to Reach USD 107.0 Billion by 2033; Amid Rising Demand for Advanced Semiconductor Solutions
The ability of chiplets to efficiently handle complex computations while being energy-efficient makes them highly suitable for advanced computing tasks.
Amkor and GlobalFoundries Cut Ribbon on Strategic Cooperation in Portugal
Partnership to strengthen European automotive supply chain and expand services for global customers.
SEMI ISS Europe 2024 to Spotlight European Chips Act With Focus on Innovation and Supply Chain Resilience
Leading analysts, economists, policymakers and technologists will gather at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2024, March 6-8 in Vienna, Austria, for insights into the latest trends and innovations shaping the global semiconductor industry.
nEDC300 by EDWARDS VACUUM – The Latest Generation Dry Claw Vacuum Pump
The nEDC300 from EDWARDS VACUUM is the latest iteration of mono claw vacuum pumps which boasts a range of inventive attributes that not only boost performance but also minimize noise levels, improve reliability, and facilitate on-site maintenance.
Rupert Baines Appointed CEO at QPT
QPT, a specialist in developing next generation GaN-based motor drives, has appointed Rupert Baines as its CEO with effect from 1 April 2024.
SCALINX Secures €34 Million in Second Round Funding
SCALINX, a fabless semiconductor company based in France and specializing in advanced mixed-signal chip design, has successfully concluded its second funding round, securing a global investment of €34 million.
Global Advanced IC Substrate Market Size is Projected to Reach $14.2B in 2030
With the proliferation of new IC types such as BGA (ball grid array) and CSP (chip scale package), which require different package carriers, IC substrate has significantly changed.
