Silicon Catalyst announces the admission of five promising new companies into the semiconductor industry’s highly acclaimed program.
Packaging
EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2025
The adoption of newer packaging technologies with tighter pitch requirements to support higher bandwidth needs for high-performance computing and AI applications are in turn fueling the need for new and different hybrid bonding techniques.
TechInsights Announces 2025 Global Semiconductor Supplier Award Winners
TechInsights, the authoritative information platform for the semiconductor industry, today released its 2025 Customer Satisfaction Survey along with the associated Global Semiconductor Supplier Award winners for the chip making equipment sector.
ClassOne Technology and IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
ClassOne Technology and IBM Research today announced they have signed a joint development agreement focused on wet processing for advanced packaging.
Advanced Interconnect Process Control with Picosecond Ultrasonic Technology for AI Device Packaging
Picosecond ultrasonic technology can provide a metrology solution with excellent accuracy and gage capability for the control of interconnect processes in advanced packaging.
centrotherm clean solutions Becomes Pfeiffer Vacuum+Fab Solutions
The Busch Group, one of the largest vacuum solution providers worldwide, announces that its brand centrotherm clean solutions will become part of Pfeiffer Vacuum+Fab Solutions.
POET Appoints Ghazi Chaoui, PhD, as Senior Vice President – Global Manufacturing and Digital Transformation
POET Technologies Inc. today announced the appointment of Ghazi M. Chaoui, PhD, MBA as its Senior Vice President of Global Manufacturing and Digital Transformation.
SMC Korea 2025 to Spotlight Next-Generation Memory and Materials Innovation Amid AI Boom
The Strategic Materials Conference (SMC) Korea 2025 is set to convene on May 14 at the Suwon Convention Center in Gyeonggi-do, South Korea, bringing together leading experts and innovators to highlight the critical role of materials innovation in addressing the performance, efficiency, and scalability requirements of AI-enabled semiconductor devices.
NEO Semiconductor Unveils Breakthrough 1T1C and 3T0C IGZO-Based 3D X-DRAM Technology
Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026, the new 1T1C and 3T0C designs combine the performance of DRAM with the manufacturability of NAND, enabling cost-effective, high-yield production with densities up to 512Gb — a 10x improvement over conventional DRAM.
Kioxia Receives IEEE Corporate Innovation Award
Kioxia Corporation today announced that it has received the IEEE Corporate Innovation Award from the Institute of Electrical & Electronics Engineers (IEEE), the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.
