Synopsys, Inc. announced today its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC’s most advanced processes and advanced packaging technologies to accelerate AI chip design and 3D multi-die design innovation.
Packaging
The Northeast Microelectronics Coalition Announces $1.43 Million to 19 Semiconductor Companies
The Northeast Microelectronics Coalition (NEMC) Hub today announced $1,432,373 in awards to 19 startups and small businesses through its Powering Regional Opportunities for Prototyping Microelectronics (PROPEL) Operations Program.
Mouser Electronics Receives 2024 Americas Titan Award for Digital POS by ams OSRAM
Mouser’s partnership with ams OSRAM supports Mouser customers in the development of automotive, industrial, and medical applications.
The 2025 Symposium on VLSI Technology & Circuits – “Cultivating the VLSI Garden: From Seeds of Innovation to Thriving Growth”
For the 45th consecutive year delivering a unique convergence of microelectronics technology and circuits in one venue, the Symposium on VLSI Technology & Circuits will be held as an in-person event in Kyoto, Japan on June 8-12, 2025.
Bruker Introduces nVista 2P Miniature Microscope
Bruker Corporation today announced the launch of the nVista 2P miniature, two-photon microscope, a groundbreaking addition to the Inscopix product line for functional imaging of freely behaving animals.
Lam Research Donates Leading-Edge Etch System to Accelerate Nanofabrication R&D at UC Berkeley
Lam Research Corp. today announced the donation of its innovative multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance research and development (R&D) for next-generation chip technologies.
Driving Sustainable Manufacturing in ASEAN: The Ripple Effect of Validated Net-Zero Commitments
A promising pathway to achieving net-zero emissions in the manufacturing sector is through the adoption of validated commitments.
Micron Announces Business Unit Reorganization to Capitalize on AI Growth Across All Market Segments
Micron Technology, Inc. today announced a market segment-based reorganization of its business units to capitalize on the transformative growth driven by AI, from data centers to edge devices.
JEDEC and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard
JEDEC Solid State Technology Association today announced the publication of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4.
SiC Schottky Diodes from Diodes Incorporated Deliver Industry-Leading FOM and System Efficiency
Diodes Incorporated today announces the expansion of its silicon carbide (SiC) product portfolio with a series of five high-performance, low figure-of-merit (FOM) 650V SiC Schottky diodes.
