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Carrie Esko Joins SIA Team

The Semiconductor Industry Association (SIA) today announced Carrie Esko has joined the SIA team. Esko will serve as director of global policy for trade and supply chain matters.

Advanced Energy Unveiled New Smart Monitoring and Digital Control Capabilities for AC-DC High Power Supplies

Advanced Energy has unveiled a new hardware accessory for its ultra-efficient, high-power suppliers. AE’s PowerPro Dongle unlocks real-time powerful monitoring, control and diagnostics capabilities for designers.

EtherCAT Technology Group’s Semiconductor Working Group Hosts 25th Meeting in Silicon Valley

In addition to the regular work on profiles for the semiconductor industry, the group also took time to look back on the successes of the working group since it was founded in 2011.

Biden-Harris Administration Announces Preliminary Terms with GlobalWafers

The proposed CHIPS investment would support the construction of new wafer manufacturing facilities and the creation of 1,700 construction jobs and 880 manufacturing jobs.

Wafer Fab Equipment: 2024 Revenue Holds Steady, Poised for 2025 Surge

Yole Group announces a 2024 revenue (calendar year) to increase by 1.3% year-on-year, reaching $108.1 billion, despite a 12% quarter-to-quarter drop in Q1 2024.

Intel Launches Its First US Apprenticeship for Manufacturing Facility Technicians

The program will train facility technician apprentices over the next five years in Arizona.

Adeia Wins ECTC Award for Paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”

Adeia Inc. was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024. 

Pankaj Kukkal of NXP Semiconductors Reelected Board Chair Of Silicon Integration Initiative

Pankaj Kukkal, executive vice president of MCU/MPU Engineering for NXP Semiconductors, has been reelected to a third term as board chair of Silicon Integration Initiative for 2024-2025.

Compact and Scalable Multiple-Input Multiple-Output Systems for Future 5G Networks

A 28GHz time-division multiple-input multiple-output (MIMO) receiver with eight radio frequency elements, each occupying just 0.1 mm², has been developed by researchers at Tokyo Tech using 65nm CMOS technology.

Mouser Electronics Awarded for Outstanding Performance from its Manufacturer Partners

Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, today announced that it has received 25 top business awards from its manufacturer partners for best-in-class performance during 2023, including over a dozen Distributor of the Year (DOY) Awards.

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