Packaging

High-end O-Rings to Grow 2x Faster than Wafer Starts

FFKM O-Rings remains low-risk pathway for semiconductor manufacturing.

EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications

Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX).

Soitec Extends Partnership with UMC

Soitec (Euronext Paris) today announced the expansion of its partnership with UMC, a global semiconductor foundry company, to bring to the market the industry’s first 3D IC solution for Radio Frequency Silicon-on-Insulator (RF-SOI) technology for the 5G era.

Alphawave Semi Expands Partnership with Samsung Foundry

Alphawave Semi has announced the expansion of its strategic partnership with Samsung Foundry, one of the world’s leading advanced semiconductor manufacturers.

Ayar Labs Welcomes Intel Veteran Pooya Tadayon as VP of Packaging and Test

Tadayon to accelerate ecosystem development and scalability for high-volume delivery of in-package optical I/O for next-generation AI systems.

SEMI Applauds New Legislative Solution to Address Gap in U.S. CHIPS Act Notice of Funding Opportunity

SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, issued the following statement from Joe Stockunas, President of SEMI Americas.

Diraq Achieves Record Accuracy for Quantum Computing Device Manufactured by Existing Semiconductor Infrastructure

99.9% single-qubit fidelity demonstrated on quantum processing device utilizing industry-standard CMOS materials.

Pfeiffer Vacuum Introduces Dry Chiller Module for Container Closure Integrity Testing (CCIT) at Low Temperatures

Pfeiffer Vacuum introduces an addition to both new and existing leak detection systems: the Dry Chiller Module. Serving as an extended cooling component for ASM 2000 and AMI 1000 leak detectors, this module sets new benchmarks in producing dependable data for testing container closure integrity at low temperatures.

Miniaturizing a Laser on a Photonic Chip

Scientists led by Dr Yang Liu and Professor Tobias Kippenberg at EPFL have built the first ever chip-integrated erbium-doped waveguide laser that approaches the performance with fiber-based lasers, combining wide wavelength tunability with the practicality of chip-scale photonic integration.

Nordson Test & Inspection to Showcase Advanced Semiconductor Technologies at SEMICON West 2024

Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2024, scheduled to take place July 9-11 at the Moscone Center in San Francisco, California.

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