The total MPU market is on track to exceed $100 billion for the first time ever this year, thanks to strong increases in cellphone application processor revenues, says Mid-Year Update.
Packaging
Discovery Paves Way for Improved Quantum Devices
Physicists and engineers have found a way to identify and address imperfections in materials for one of the most promising technologies in commercial quantum computing.
Alif Semiconductor Launches Cutting Edge Families of Scalable, Secure, AI-enabled Microcontrollers
Alif Semiconductor, supplier of secure, connected, AI-enabled and power efficient microcontrollers (MCUs) and fusion processors, today announced the launch of its Ensemble and Crescendo product families.
SEMI Anti-Piracy Server Certification Protocol for Software License Management Reaches Key Milestone
SEMI and the ESD Alliance, a SEMI Technology Community, announced completion of the anti-piracy server certification protocol for software license management, a year-long joint development effort led by the Electronic System Design Alliance.
Third Quarter Outlook on 2021 Semiconductor Materials
TECHCET announced 2021 semiconductor materials revenues will top $57B, growing by 8% to 30%, covering the spectrum of materials segments.
Renesas Completes Acquisition of Dialog Semiconductor
Renesas Electronics Corporation and Dialog Semiconductor Plc announced the successful completion of Renesas’ acquisition of the entire issued and to be issued share capital of Dialog.
Semiconductor Packaging Market to Reach $60.44B by 2030
A new report predicts that the global semiconductor packaging market will reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030.
New Plating Tool for WLP and Plating in Compound Semi Manufacturing
ACM’s Ultra ECP GIII plating tool is designed for WLP for compound semiconductors, with product offerings for SiC, GaN and GaAs. The tool is also capable of plating gold into backside deep hole processes with greater uniformity and better step coverage.
Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem
Intel Foundry Services will lead the first phase of the U.S. Department of Defense’s RAMP-C program to establish a domestic commercial foundry infrastructure.
Samsung Brings In-memory Processing Power to Wider Range of Applications
Samsung’s revelations at Hot Chips include the first successful integration of its PIM-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system, and broadened PIM applications to embrace DRAM modules and mobile memory.
