Researchers investigate how the thermal penalty of 3D integration can be minimized.
Packaging
EV Group Brings Revolutionary Layer Transfer Technology to High-Volume Manufacturing With EVG850 NanoCleave System
Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and transistor scaling.
NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM
NEO Semiconductor, a developer of technologies for 3D NAND flash and DRAM memory, today announced findings of 3D X-DRAM simulations.
Micron Unveils Client SSD to Fuel Demanding PC Applications
Micron Technology, Inc. today announced it is shipping the Micron 3500 NVMe SSD, which leverages its 232-layer NAND to power demanding workloads for business applications, scientific computing, cutting-edge gaming and content creation, pushing the limits of what is possible.
Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets
Based at CEA-Leti, collaboration focuses on materials engineering solutions to accelerate semiconductor device development for Applied’s ICAPS customers.
Axcelis Announces Grand Opening of the Company’s New Logistics Center in Beverly, MA
The Company celebrated this milestone event with a ribbon-cutting ceremony led by President and CEO Russell Low.
Amkor Announces US Advanced Packaging and Test Facility
Amkor Technology, Inc., a provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona.
2D Material Reshapes 3D Electronics for AI Hardware
Researchers demonstrated monolithic 3D integration of layered 2D material into novel processing hardware for artificial intelligence computing. The new approach provides a material-level solution for fully integrating many functions into a single, small electronic chip — and paves the way for advanced AI computing.
TPL for Photonic Packaging: A Promising Solution
In a new paper published in Light Advanced Manufacturing, a team of scientists led by Dr. Shaoliang Yu and Qingyang Du have developed new packaging technologies.
Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings contracted 11% year-over-year to US$25.6 billion in the third quarter of 2023, while quarter-over-quarter billings slipped 1% during the same period.
