Packaging

Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm

Rambus Inc. announced the Rambus HBM2E memory interface subsystem, consisting of a fully-integrated PHY and controller, is silicon proven on Samsung’s advanced 14/11nm FinFET process.

Quantum-Si Announces Appointment of Claudia Napal Drayton as Chief Financial Officer

Quantum-Si Incorporated, a pioneer in next-generation semiconductor chip-based proteomics, announced today the appointment of Claudia Napal Drayton as Chief Financial Officer.

DeepCube Acquired by Nano Dimension

DeepCube has signed a definitive agreement to be acquired by Nano Dimension Ltd.

New Conductive Polymer Ink Opens for Next-Generation Printed Electronics

Researchers at Linköping University, Sweden, have developed a stable high-conductivity polymer ink. The advance paves the way for innovative printed electronics with high energy efficiency.

Pfeiffer Vacuum Presents Extension to DigiLine series

For more than 20 years now, Pfeiffer Vacuum’s portfolio has included its comprehensive DigiLine range of digital total vacuum pressure gauges, which can be modularly adapted to suit any industrial vacuum application.

White House Chip Summit Builds Momentum for Federal Investments in U.S. Chip Manufacturing and Research

The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding today’s meeting at the White House between Biden Administration officials and leaders from the semiconductor industry and other sectors to discuss the global chip shortage, President Biden’s infrastructure plan, and other issues related to the semiconductor supply chain.

SEMI Appoints imec and Soitec Executives as Chairs of SEMI Europe Advisory Board

SEMI today announced the appointments of Luc Van den hove, president and CEO of imec, as chair and Paul Boudre, CEO of Soitec, as vice chair of the SEMI Europe Advisory Board.

Protect Valuable Drive Technology with Pfannenberg Thermal Management and Filter Technology

Pfannenberg, Inc., a global manufacturer of thermal management technologies, announces that it is possible to protect valuable investments in drive technology through the use of thermal management and filter products.

Cadence Pegasus Verification System Certified for Samsung Foundry 5nm and 7nm Process Technologies

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence Pegasus Verification System has achieved certification for Samsung Foundry’s 5nm and 7nm process technologies.

Chinese Companies Hold Only 5% of Global IC Marketshare

Propelled by 50% share of IDM sales and 64% share of fabless sales, U.S. companies captured 55% of the total worldwide IC market in 2020.

Featured Products