Palomar Technologies announced today that Electronics and Photonics Innovation Center (EPIC) has purchased a fully loaded 3880 Die Bonder.
Packaging
Secure-IC Announces the Availability of its Protection Technologies in the Cloud
Secure-IC announces today the availability of its protection technologies (“Silicon Intellectual Property” – IPs) in the Cloud.
Semtech and AWS Collaborate on AWS IoT Core for LoRaWAN
Semtech Corporation announced that they have teamed up with Amazon Web Services (AWS) to integrate the LoRaWAN protocol on the Network Server with AWS IoT Core, AWS’s managed Cloud service that lets connected devices easily and securely interact with Cloud applications and other devices.
IAR Systems Enables Linux-Based Continuous Integration and Automated Workflows for RISC-V
IAR Systems, the future-proof supplier of software tools and services for embedded development, releases an update of its RISC-V build tools supporting implementation in Linux-based frameworks for automated application build and test processes.
Onto Innovation Announces First Customer Qualification of New Aspect IRCD System
Onto Innovation Inc. today announced the first customer acceptance and purchase of its new product, the Aspect System, at one of the top three memory manufacturers of leading-edge 3D-NAND devices.
CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks.
SUEZ Unveils New Sievers TOC Analyzers for Online Ultrapure Water Monitoring
SUEZ – Water Technologies & Solutions announced the launch of two new Total Organic Carbon (TOC) online analyzers, the M500 for life sciences and the M500e for microelectronics markets.
Verific and DARPA Sign Partnership for Streamlined Access to Industry-Standard SystemVerilog EDA Software
Verific Design Automation today announced a partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to provide the DARPA community access to its electronic design automation (EDA) software in production and development use throughout the semiconductor industry.
Industry Strategy Symposium to Lead Microelectronics Into New Era of Innovation
SEMI announced today that the virtual Industry Strategy Symposium (ISS) 2021 will take place January 12-13 with the theme Bridging the Gap Between the Physical and Digital Worlds.
SEMI Technology Unites Global Summit to Spotlight Digital Transformation, Microelectronics Industry Innovation and Growth
Global industry executives from all seven SEMI regions will gather online for the inaugural SEMI Technology Unites Global Summit, February 15-19, 2021, for keynotes on the power of technology to unite the world and insights on how the microelectronics industry can shape the digital future.
