Toshiba Memory America, Inc. announced that its XFMEXPRESS technology for removable PCIe attached, NVM memory devices has received a Flash Memory Summit ‘Best of Show’ award.
Packaging
Nordson MARCH to Present Paper on Plasma Applications for Wafer-Level Packaging at ICEPT
Nordson MARCH, a division of Nordson will present the paper, “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong 11-15 August 2019. The session will be held on August 14 at 11:55 AM.
GLOBALFOUNDRIES and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications
Arm’s interconnect technology on GF’s 12LP process enables high performance and low latency, while increasing bandwidth for high core designs in AI, Cloud Computing and Mobile SoCs.
Mid-Year Global Semiconductor Sales Down 14.5 Compared to 2018
Year-to-year sales down across all regions; 2019 Q2 sales up slightly compared to Q1.
Toshiba Memory Unveils New Technology for Removable NVMe Memory Devices with Groundbreaking Size to Performance Ratio
Toshiba Memory America, Inc., the U.S.-based subsidiary of Toshiba Memory Corporation, today announced XFMEXPRESS, a new technology for removable PCIe attached, NVMe memory devices.
Microchip Enters Memory Infrastructure Market with Serial Memory Controller for High-performance Data Center Computing
As the computational demands of artificial intelligence (AI) and machine learning workloads accelerate, traditional parallel attached DRAM memory has presented a major roadblock for next-generation CPUs, which require an increased number of memory channels to deliver more memory bandwidth.
Toshiba Memory Introduces XL-FLASH Storage Class Memory Solution
Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced the launch of a new Storage Class Memory (SCM) solution: XL-FLASH.
Lenovo and Intel Announce Multiyear Global Collaboration to Extend HPC and AI Leadership
Intel and Lenovo today announced a multiyear collaboration focused on the rapidly growing opportunity in the convergence of high-performance computing (HPC) and artificial intelligence (AI) to help accelerate solutions for the world’s most challenging problems.
MagnaChip Offers 0.35 micron 700V Ultra-High Voltage Process Technologies for Various System Requirements
MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it now offers 0.35 micron 700V Ultra-High Voltage process technologies (UHV) suitable for different system requirements for AC-DC converter ICs and LED driver ICs.
Hprobe to Present Breakthrough Technology for Ultra-Fast Magnetic Testing of MRAM Devices above 2 Tesla
Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, will present at the MRAM Developer Day 2019*, a new technology of magnetic generator for ultra-fast testing time (less than one second) of Magnetic Tunnel Junction (MTJ) for Spin Transfer Torque (STT) MRAM devices under perpendicular magnetic field at above 2 Tesla.
