ULVAC Technologies, Inc. has announced that Dr. Koukou Suu, of ULVAC Japan, will serve as the new CEO of ULVAC’s North American subsidiary, ULVAC Technologies, Inc., based in Methuen, MA.
Packaging
Changes in the Advanced Packaging Supply Chain: Opportunity or Misfortune?
Amidst a dynamic ecosystem, the semiconductor supply chain is undergoing change at various levels. Some players have successfully managed to expand into a new business model and significantly impact the IC manufacturing chain, while others have failed to take off.
Toshiba Memory to Rebrand as “Kioxia” in October
Toshiba Memory Holdings Corporation announced today that it will officially change its name to Kioxia Holdings Corporation on October 1, 2019.
Samsung Begins Mass Production of Industry’s First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones
Samsung Electronics Co. today announced that it has begun mass producing the industry’s first 12-gigabit (Gb) LPDDR5 mobile DRAM, which has been optimized for enabling 5G and AI features in future smartphones.
Pioneer Micro Technology Launches Silvaco PDK for Its 0.35 µm Silicon Foundry CMOS Process
Silvaco Japan Co., Ltd. today announced that Pioneer Micro Technology Corp. (PMT) has begun providing a Process Development Kit (PDK) for Silvaco tool users targeting the manufacture of IC designs in PMT’s 0.35 µm CMOS process technology.
Semiconductor Intellectual Property (IP) Market to Grow at 8.8% During 2018-2026 on the Back of Advancements in Multi-core Technology
The global semiconductor intellectual property market is prognosticated to expand at steady CAGR of 8.8% within the forecast period from 2018 to 2026. By the end of 2026, the semiconductor IP market is likely to be valued around worth US$ 9,437.8 mn.
Alpha and Omega Semiconductor Introduces New Source Down Packaging Technology
Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of power semiconductors and power ICs, today introduced the “Source Down” in a DFN 5×6 package in combination with a 40V Shield-Gate Technology (AlphaSGT™). AOS’ innovative flip-chip know-how achieves the Source Down capability and this packaging technology offers a very low package resistance and inductance. The AOE66410 is ideally suited in telecommunications applications…
Intel Unveils New Tools in Its Advanced Packaging Toolbox
Last week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel’s advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology.
Synopsys Awarded DARPA ERI Contract Extension
Synopsys, Inc. (Nasdaq: SNPS) today announced a contract extension from the Defense Advanced Research Projects Agency (DARPA) for the Posh Open Source Hardware (POSH) program to continue innovations in analog/mixed-signal (AMS) verification.
The MOSIS Service Selects Synopsys’ IC Validator for Large-scale FinFET SoCs
Synopsys, Inc. today announced that The MOSIS Service, a provider of Multi-Project Wafers, has selected Synopsys’ IC Validator tool for physical verification signoff.
