Packaging

Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging Technologies

This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.

SIA Commends Selections for CHIPS R&D Flagship Facilities

The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.

Infineon Launches New Generation of GaN Power Discretes

Infineon Technologies AG today announced the launch of a new family of high-voltage discretes, the CoolGaN Transistors 650 V G5, further strengthening its Gallium Nitride (GaN) portfolio.

Research for the Future, Application Transfer for the Present

Advancements in industry and technology are constantly demanding new solutions for the manufacturing of microchips regarding the technical, economic and also ecological perspective.

Onto Innovation Announces “Tuck-In” Acquisition of Lumina Instruments, Inc. and Lithography Business of Kulicke and Soffa

Onto Innovation Inc., a global provider of process control and packaging lithography solutions to the semiconductor market, today announced that it has acquired Lumina Instruments, Inc. based in Milpitas, California.

Nordson Test & Inspection’s New SpinSAM AMI System Wins Prestigious Global Technology Award

Nordson Test & Inspection today announced that its SpinSAM Acoustic Microimaging (AMI) system has been honored with the prestigious 2024 Global Technology Award in the Test Equipment category.

US-Manufactured Nanopositioning Stage for Super Resolution Microscopy, Material Science

PI (Physik Instrumente) offers a series of piezo-flexure controlled nanopositioning stages for high-resolution microscopy and material science applications.

James Culp of GlobalFoundries Joins Si2 Board

The Silicon Integration Initiative has announced the addition of James Culp, a GlobalFoundries corporate fellow, to its board of directors.

Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the First CHIPS for America R&D Flagship Facility

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility.

ULVAC Launches Technology Center PYEONGTAEK for Next-Gen Semiconductor Manufacturing Equipment in South Korea

ULVAC, Inc. has established Technology Center PYEONGTAEK in Pyeongtaek, Gyeonggi-do, South Korea.

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