Busch Vacuum Solutions, one of the largest vacuum pump manufacturers worldwide, has acquired centrotherm clean solutions, one of the technology leaders in industrial gas abatement systems.
Packaging
Advanced IC Substrates: Taiwanese Companies Lead the Market
Increasing capacity expansion by substrate manufacturers to accommodate the growth of application processors in the AI age.
NextFlex Announces $6.5 Million in Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability
Projects include developments of additive approaches for complex multilayer 3D electronics, high and low temperature interconnects with proven reliability and in-mold electronics for automotive applications.
TECHCET Announces Call for Papers for 2024 CMC Conference
TECHCET announces an official call for papers for the 9th Annual Critical Materials Council (CMC) Conference taking place on April 10-11, 2024 in Chandler, Arizona.
XTPL Enters Manufacturing Lines of Modern Electronics with its Groundbreaking Ultra-Precise Dispensing Technology
This technology has just become available to the industrial market, offering unprecedented precision in mass production.
Entegris Opens Dedicated Additive Manufacturing Technology Center in Singapore
Entegris, Inc. announced the opening of its Singapore Digital Manufacturing Technology Center (SDMTC).
Global Semiconductor Manufacturing Industry Set for Q4 2023 Recovery, SEMI Reports
The global semiconductor manufacturing industry is on track for recovery in the fourth quarter of 2023, setting the stage for continued growth in 2024, SEMI announced today.
SEMICON Europa 2023 Opens Tomorrow to Showcase Sustainability Innovation and Talent Strategies Shaping a $1 Trillion Era
SEMICON Europa 2023 opens tomorrow with industry experts from across the electronics design and manufacturing supply chain gathering to present insights into the latest developments and trends across key semiconductor industry growth segments including advanced packaging, materials, MedTech and mobility.
Cadence EMX 3D Planar Solver Certified for Samsung Foundry 8nm LPP Process Technology
Cadence Design Systems, Inc. today announced that the Cadence EMX 3D Planar Solver is now certified for use with Samsung Foundry’s advanced 8nm Low Power Plus (LPP) process technology.
CEA-Leti Will Present Gains in Ultimate 3D, RF & Power, and Quantum & Neuromorphic Computing with Emerging Devices
Institute to host annual Leti Devices Workshop on Dec. 10: ‘Semiconductor Devices: Moving Towards Efficiency & Sustainability’
