ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today introduced the Ultra SFP ap tool for advanced packaging solutions. The Ultra SFP ap is designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP), such as copper overburden post-TSV fill and wafer warpage issues that plague FOWLP processes.
Packaging
“Black Swan” Event Triggers Revision to 2020 IC Market Forecast
The recent surge of the spread of the coronavirus (Covid-19) and its anticipated negative impact on the global economy and IC market definitely fits the definition of a Black Swan event.
Power Integrations’ SCALE-iDriver for SiC MOSFETs Achieves AEC-Q100 Automotive Qualification
Power Integrations (Nasdaq: POWI), the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced that its SIC118xKQ SCALE-iDriver™, a high-efficiency, single-channel gate driver for silicon carbide (SiC) MOSFETs, is now certified to AEC-Q100 for automotive use. Devices can be configured to support gate-drive voltage requirements of commonly used SiC MOSFETs and feature sophisticated safety and protection features.
CyberOptics Receives New Orders for Memory Module and Micro LED Inspection and Metrology Systems
CyberOptics Corporation® (Nasdaq: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, today announced that it has received orders valued at approximately $2.8 million for its 2D MX600™ system for post-singulation inspection of memory modules. CyberOptics presently anticipates that these orders will become revenue in the third quarter of 2020.
Pfeiffer Vacuum Introduces Extremely Quiet, Dry Pumps
The HiScroll models from Pfeiffer Vacuum’s new range of scroll pumps are oil-free, hermetically sealed vacuum pumps with high nominal pumping speeds of 6 to 20 m³/h. The new pumps are characterized by their compact design and quiet, low-vibration operation (<47 dB[A], and <42 dB[A] in stand-by mode).
Ranovus Announces a Strategic Collaboration with IBM, TE Connectivity and Senko Advanced Components
Ranovus Inc. (“RANOVUS”) today announced a strategic collaboration with IBM Inc. (“IBM”), TE Connectivity (“TE”) and Senko Advanced Components, Inc (“SENKO”), leading providers of multi-terabit interconnect solutions, to create an ecosystem to design and manufacture multi-vendor solutions for Co-Packaged Optics applications in data center.
Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm
Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of Magnetoresistive RAM (MRAM), today announced an amendment of its Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) with GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry.
Olympus Supports FMC/TFM Training with OmniScan X3 Flaw Detectors
Olympus, a leading manufacturer of nondestructive testing (NDT) inspection equipment, is delivering new OmniScan X3 phased array flaw detectors with FMC/TFM to the University of Ultrasonics to support their advanced training courses.
Synopsys Introduces Machine Learning-Based Auto Segmentation Module for 3D Image Processing
Synopsys, Inc. (Nasdaq: SNPS) today announced the release of a major update to Simpleware™ ScanIP software, which extends its capabilities for segmenting anatomical regions through a new module, Simpleware AS Ortho (Auto Segmenter for Orthopedics). This new product offering is a machine learning (ML)-based auto segmentation module that builds on Synopsys’ ScanIP software, a comprehensive solution for 3D image processing and segmenting images generated by computed tomography (CT) or magnetic resonance imaging (MRI) scanners.
Infineon and pmdtechnologies Collaborate With Qualcomm to Enable High-Quality Standard Solution for 3D Authentication
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) worked with Qualcomm Technologies, Inc. to develop a reference design for 3D authentication based on the Qualcomm® Snapdragon™ 865 Mobile Platform. Infineon is thus extending its application portfolio of its 3D sensor technology for mobile devices.
