Ranovus Inc. (“RANOVUS”) today announced a strategic collaboration with IBM Inc. (“IBM”), TE Connectivity (“TE”) and Senko Advanced Components, Inc (“SENKO”), leading providers of multi-terabit interconnect solutions, to create an ecosystem to design and manufacture multi-vendor solutions for Co-Packaged Optics applications in data center.
The collaboration leverages:
1- RANOVUS’ highly scalable Odin™ silicon photonics engine announced earlier (https://ranovus.com/ranovus-launches-its-single-chip-odin-silicon-photonic-engine-to-support-ml-ai-workloads-for-data-center-and-5g-mobility/). Odin™ incorporates the company’s disruptive innovation in multi-wavelength Quantum Dot Laser (QDL), 100Gbps Silicon Photonics based Micro Ring Resonator modulators and photodetectors, 100Gbps Driver, 100Gbps TIA and control Integrated Circuits in a power efficient and cost-effective EPIC in a single chip.
2- IBM’s innovative fiber V-groove interconnect packaging technology is a robust and reliable assembly technique to interface optical fibers to silicon photonics devices. This process makes use of passive alignment techniques and achieves low insertion loss across a wide spectral range in both the O-band and C-band regimes. The solution is scalable in physical channel count and the automated process provides a path to high-volume manufacturing of co-packaged optics.
3- TE’s co-packaged (CP) fine pitch socket interposer technology enables integration of small chipset and optical engine component technologies into high-value co-package assemblies with reworkable and interoperable interfaces. The signal integrity performance of the CP fine pitch socket interposer technology can be critical to 100 Gbps high density electrical packaging requirements. The integration of TE’s thermal bridge technology completes the assembly by providing an innovative solution for thermal management of the switch, serializer/deserializer (SerDes), and optics necessary for high reliability and long operating life.
4- SENKO’s fiber optic connectivity solutions for optical coupling, on-board/mid-board, and faceplate to support 100Gbps/lane and beyond Co-Packaged Optics equipment designs. These include low profile and precision Fiber coupler assemblies, micro sized on-/mid-board connectors, reflow compatible connector assemblies, and space saving connector options for faceplate. These will provide more efficiency, scalability, and flexibility in designs for Co-Packaged Optics equipment.
With data center traffic growing at an unprecedented pace, the networking infrastructure needs to scale in capacity while maintaining its total power consumption and footprint. Today’s disaggregated Ethernet switch IC and optical module architecture does not provide the scalability required to support the future growth of the data centers. Co-packaging of optics and Ethernet switch ICs is a natural next step to reduce the power consumption burden of the electrical I/Os in the data center networking equipment. The transition of the Ethernet switch IC SER/DES from 50Gbps to 100Gbps, in 25.6Tbps and 51.2Tbps switch configurations, presents a unique inflection point in the architecture of the Ethernet switch systems.
“RANOVUS’ Odin™ platform was conceived with miniaturized components such as Micro Ring Resonators in a monolithic Electronic and Photonic Integrated Circuit to deliver highly scalable solutions in support of single and multi-wavelength applications.” Said Georg Roell, Chief Technology Officer at Ranovus. “We are delighted to contribute our IP and create an ecosystem to remove a major hurdle for the adoption of Co-Packaged Optics solutions for data centers”.
“IBM is enthusiastic to bring to this collaboration more than 45 years history in microelectronics packaging and its deep experience in optical packaging,” said Paul Fortier, senior engineer, IBM business development. “IBM’s optical assembly processes leverage our automated high-volume semiconductor packaging and IBM’s Assembly and Test division provides the co-packaged optics ecosystem with a seamless end to end manufacturing capability.”
“TE is pleased to be able to bring decades of socket expertise to this co-packaging effort in the form of the fine pitch CP socket technology” said Nathan Tracy, Technologist, TE Connectivity, “In addition, TE’s thermal bridge technology is a key enabler to the high density packaging and extreme thermal management necessary for co-packaging”.
“SENKO is pleased to contribute our product designs, and IPs to enhance the design capability, scalability, and flexibility for the Co-Packaged Optics embedded products.” Said Tiger Ninomiya, Business Development / Product Line Manager at SENKO. “Innovative optical connectivity solutions are key to making Co-Packaged Optics’ solutions a success in the market.”