Achronix Semiconductor Corporation, a provider in FPGA-based hardware accelerator devices and high-performance eFPGA IP, has joined the TSMC IP Alliance Program, a key component of TSMC Open Innovation Platform® (OIP). Achronix’s award-winning Speedcore eFPGA IP is optimized for high-end and high-performance applications. Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC).
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Samsung Introduces Industry’s First 0.7μm-pixel Mobile Image Sensor
Samsung Electronics Co., Ltd. today introduced the industry’s first 0.7-micrometer (μm)-pixel image sensor, the 43.7-megapixel (Mp) Samsung ISOCELL Slim GH1. Thanks to advanced ISOELL Plus technology, the new ultra-high-resolution GH1 image sensor embraces 43.7-million 0.7μm-sized pixels in a super-small package, providing the optimum solution for slim full-display devices.
Bottom-Up Synthesis of Crystalline 2D Polymers
Scientists at the Center for Advancing Electronics Dresden (cfaed) at TU Dresden have succeeded in synthesizing sheet-like 2D polymers by a bottom-up process for the first time. A novel synthetic reaction route was developed for this purpose. The 2D polymers consist of only a few single atomic layers and, due to their very special properties, are a promising material for use in electronic components and systems of a new generation. The research result is a collaborative work of several groups at TU Dresden and Ulm University and was published this week in two related articles in the scientific journals “Nature Chemistry” and “Nature Communications”.
Revolutionizing Wafer Testing to Bring New Technologies to Market
Nearly every new technology breakthrough in the semiconductor industry targets high volume manufacturing and comes with its unique specificities. This results in challenges for engineers to manufacture and test new integrated circuits (ICs) on the wafer.
MagnaChip Targets Fast-Growing e-Bike Market with High-Performance MOSFET
MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today the release of a 100V Mid-Voltage MOSFET (Metal Oxide Semiconductor Field-Effect Transistor) with a new thermal package (“M2PAK-7P”) designed for the fast-growing e-Bike market. This MOSFET with M2PAK-7P is suitable to meet the particular requirements of electric bike (e-Bike) systems. E-Bikes, an emerging trend especially with electric scooters, have…
Tachyum Joins Intel, AMD, and nVidia With New Headquarters in Santa Clara
Tachyum, a semiconductor startup and developer of the world’s first Universal Processor platform, today announced the opening of its new, larger corporate headquarters in Santa Clara to better accommodate the rapidly growing number of customers, partners, vendors and its growing personnel ranks. The new offices are located at 2520 Mission College Blvd, Suite 201, Santa Clara CA 95054. Tachyum’s new facilities will better enable the company to finish development, start marketing and selling its disruptive products that tackle the most pressing global issues in data centers, AI, telecommunications, edge computing and mobility today.
Erik Pederson Joins Semiconductor Industry Association as Government Affairs Director
The Semiconductor Industry Association (SIA) announced Erik Pederson has joined the association as government affairs director. In this role, Pederson will work with Congress, the White House, and federal agencies to advance the semiconductor industry’s policy priorities, particularly those related to trade, export control, and tax. SIA represents U.S. leadership in semiconductor manufacturing, design, and research.Pederson most recently served as director of government relations at the Chicago Council on Global Affairs, a bipartisan think tank.
SEMI, SUNY Poly Awarded $6 Million National Science Foundation Grant for Pilot Program to Grow Electronics Industry Talent Pipeline
SEMI, the global industry association representing the electronics manufacturing and design supply chain, and SUNY Polytechnic Institute today announced that they have been awarded a $6 million grant from the National Science Foundation (NSF) to fund workforce development initiatives for the microelectronics manufacturing industry. The funding, to be provided over three years, will support the development and implementation of a semiconductor workforce certification program designed to meet the industry’s most pressing needs.
North American Semiconductor Equipment Industry Posts August 2019 Billings
North America-based manufacturers of semiconductor equipment posted $2.00 billion in billings worldwide in August 2019 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.4 percent lower than the final July 2019 level of $2.03 billion, and is 10.5 percent lower than the August 2018 billings level of $2.23 billion.
Edwards’ 100th Year Environmental Award Recognises SEMI High-Tech Facility Committee
Edwards presented its 100th Year Environmental Award to SEMI’s High-Tech Facility Committee at a ceremony held last night in conjunction with the SEMICON Taiwan conference. The award recognizes an individual or group within the semiconductor industry that has made a significant contribution to the protection of the environment for future generations. Edwards created the award to celebrate its own one-hundred-year history creating environments where innovation can thrive.
