Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has brought the latest software innovations to the company’s most cutting-edge PCIe Gen4 solid state drive (SSD) series, opening up a new paradigm in SSD performance.
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The Future of ‘Extremely’ Energy-Efficient Circuits
Data centers are processing data and dispensing the results at astonishing rates and such robust systems require a significant amount of energy — so much energy, in fact, that information communication technology is projected to account for 20% of total energy consumption in the United States by 2020. To answer this demand, a team of researchers from Japan and the United States have developed a framework to reduce energy consumption while improving efficiency.
Scientists Create Fully Electronic 2-Dimensional Spin Transistors
Physicists from the University of Groningen constructed a two-dimensional spin transistor, in which spin currents were generated by an electric current through graphene.
SEMICON Taiwan 2019 Opens with Smart Tech, Innovation, Digital Future in Spotlight
With Taiwan expected to lead the world in semiconductor equipment investments in 2019, SEMICON Taiwan 2019 opens today, gathering the world’s top technologists, visionaries and innovators for insights into the latest trends and opportunities across smart vertical markets including manufacturing, automotive, healthcare and data. September 18-20 at Nangang Exhibition Center, Hall I, in Taipei, SEMICON Taiwan 2019 spans the entire semiconductor and microelectronics supply chain – from design through systems.
ZEISS Accelerates Time to Market for Advanced Semiconductor Packages with Non-destructive 3D X-ray Measurement Solution
ZEISS today introduced the ZEISS Xradia 620 Versa RepScan — a submicron-resolution, 3D non-destructive imaging solution for inspection and measurement that accelerates time to market for advanced IC packages.
Semiconductor Industry Veteran Bee Bee Ng New SEMI Southeast Asia President
SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced that semiconductor industry veteran Bee Bee Ng has joined SEMI as president of SEMI Southeast Asia, reporting to SEMI CFO Richard Salsman. Based in Singapore, Ng will direct SEMI Southeast Asia sales and services; expositions and programs including standards, EHS, workforce development and advocacy; and administrative operations.
DRAM, NAND and Emerging Memory Technology Trends and Developments in 2019
Innovation in memory technology is constant. In this article, TechInsights’ Jeongdong Choe reviews the latest developments in DRAM, NAND, and emerging technology, and provide insight on the trends in this space.
New York State Lieutenant Governor Kathy Hochul Announces Nanotronics’ New High-Tech Manufacturing Facility
Nanotronics together with New York New York State Lieutenant Governor Kathy Hochul, announced that Nanotronics will open a high-tech manufacturing center at the Brooklyn Navy Yard, creating 190 new jobs and investing $11 million.
Penn Engineers’ New Topological Insulator Reroutes Photonic ‘Traffic’ On the Fly
Dynamic data routing could make for faster photonic chips that use their entire footprint.
Fabs Valued at Nearly $50 Billion to Start Construction in 2020
Investments in new fab projects starting construction in 2020 is expected to reach nearly US$50 billion, up about US$12 billion from 2019, according to the latest update of the World Fab Forecast from SEMI.
