Packaging

Lantronix Announces Five New System-in-Package Solutions Powered by Qualcomm

Lantronix Inc. today announced its powerful new System-in-Package (SiP) solutions powered by Qualcomm Technologies’ chipsets that reinforce Lantronix’s position in industrial and enterprise IoT innovation, bringing advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the edge.

Infineon and AWL-Electricity Partner to Improve Wireless Power with GaN Power Semiconductors

Infineon Technologies AG today announced a partnership with Canada-based AWL-Electricity Inc., a pioneer in MHz resonant capacitive coupling power transfer technology.

Keysight Unveils 3kV High Voltage Wafer Test System for Power Semiconductors

Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix.

ROHM’s New PWM Controller ICs with SOP Package for Power Supplies in a Wide Variety of Industrial Applications

ROHM Semiconductor today announced new external FET-type controller ICs utilizing PWM current control mode optimized for AC-DC power supplies in various industrial applications.

Quantum Register Reaches 1200 Neutral Atoms in Continuous Operation

A Munich Quantum Valley (MQV) research team, led by the Max Planck Institute of Quantum Optics (MPQ) in collaboration with the quantum computing start-up planqc, has succeeded in running a register of 1200 atoms continuously for over an hour – a breakthrough on the way to scalable quantum computers.

2024 IEEE IEDM Spotlights Advances in Critical Semiconductor Technologies

Since it began in 1955, the IEEE International Electron Devices Meeting (IEDM) has been where the world’s best and brightest electronics technologists go to learn about the latest breakthroughs in semiconductor and related technologies.

Terecircuits Unveils New Bonding Material for Next-Generation Advanced Packaging

Terecircuits Corporation, a venture-backed startup in advanced materials for the semiconductor industry, today introduced Terefilm, a patented material designed for temporary bonding and debonding applications in advanced packaging.

Northeast Microelectronics Coalition Hub Awards More Than $1 Million to Advance Microelectronic Innovation

First-of-its-kind program awards startups and small businesses with funding to develop next-gen microelectronics technologies.

Advanced Energy Announces STEM Scholarships for 2025-2026 Academic Year

Advanced Energy Industries, Inc. today announced the launch of its 2025 – 2026 Advanced Energy STEM Scholarship Program.

Sony Semiconductor Solutions to Release CMOS Image Sensor for Automotive Cameras

Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the ISX038 CMOS image sensor for automotive cameras, the industry’s first product that can simultaneously process and output RAW and YUV images.

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