Registration has opened for SPIE Photonics West 2024, which will run from 27 January to 1 February at the Moscone Center in San Francisco.
Packaging
Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan
Presto Engineering, a recognized expert in ASIC design and semiconductor engineering and production services, announced its collaboration with Nokia for the industrialization of new equipment designed to build the foundations of the next generation of microwave links.
Kyocera Expands U.S.-Based Semiconductor Assembly Capabilities, Capacity, and Technology Investment
Company’s “one-stop solution” offers comprehensive onshore semiconductor packaging and OSAT services from 288,000sf facility in California.
Innovation Space and Silicon Catalyst Establish Collaboration for Joint Incubation
The Innovation Space a not-for-profit innovation ecosystem – and one of the nation’s largest for science entrepreneurs – and Silicon Catalyst, the world’s only incubator + accelerator focused on semiconductor solutions, have established a collaboration to co-incubate early-stage science-based enterprises focused on advanced materials and other enabling technologies critical for the semiconductor industry.
2023 IEEE International Electron Devices Meeting to Highlight Advances in Critical Semiconductor Technologies
The 2023 IEDM technical program, supporting the theme, “Devices for a Smart World Built Upon 60 Years of CMOS,” will consist of more than 225 presentations plus a full slate of panels, Focus Sessions, Tutorials, Short Courses, a career luncheon, supplier exhibit and IEEE/EDS award presentations.
KYOCERA AVX is Acquiring Assets of Bliley Technologies
KYOCERA AVX, a global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is acquiring assets of Bliley Technologies, a designer and developer of low-noise frequency control products
TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum.
Intel’s New Fab in Ireland Begins High-Volume Production of Intel 4 Technology
Intel deploys extreme ultraviolet lithography in high-volume manufacturing; use of the technology in Ireland is a first for mass production in Europe.
GlobalFoundries Unveils Power-Efficient Advancements to 22FDX Platform at Annual Tech Summit
This week at its annual Technology Summit in Europe, GlobalFoundries announced advancements to its industry-leading 22FDX (22nm FD-SOI) platform, introducing a suite of innovative features and enhancements.
USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics
In a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.
