KYOCERA AVX, a global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is acquiring assets of Bliley Technologies, a designer and developer of low-noise frequency control products
Packaging
TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum.
Intel’s New Fab in Ireland Begins High-Volume Production of Intel 4 Technology
Intel deploys extreme ultraviolet lithography in high-volume manufacturing; use of the technology in Ireland is a first for mass production in Europe.
GlobalFoundries Unveils Power-Efficient Advancements to 22FDX Platform at Annual Tech Summit
This week at its annual Technology Summit in Europe, GlobalFoundries announced advancements to its industry-leading 22FDX (22nm FD-SOI) platform, introducing a suite of innovative features and enhancements.
USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics
In a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.
Brooks Instrument Opens New Manufacturing Site in Malaysia
Brooks Instrument has opened a new manufacturing facility in Penang, Malaysia, significantly increasing its operational footprint in Asia-Pacific for producing mass flow controllers (MFCs).
FMI Analyst View: “Shaping the Future of Protection: Hermetic Packaging Solutions”
The hermetic packaging market is poised to increase at a 4.2% CAGR from 2023 to 2033, acquiring a market value of US$ 5.2 billion by the end of 2033, up from US$ 3.4 billion in 2023.
Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification
Cadence Design Systems, Inc. today announced its digital and custom/analog flows have achieved certification for TSMC’s latest N2 Design Rule Manual (DRM).
Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC’s Advanced 4nm RF FinFET Process
Keysight Technologies, Inc., Synopsys, Inc, and Ansys announced a new reference flow for the TSMC N4PRF, the world’s leading semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
GlobalFoundries and Microchip Announce Microchip’s 28nm SuperFlash Embedded Flash Memory Solution in Production
GlobalFoundries and Microchip Technology, via its Silicon Storage Technology (SST) subsidiary, today announces the immediate release to production of the SST ESF3 third-generation embedded SuperFlash non-volatile memory (NVM) solution in the GF 28SLPe foundry process.
