Amkor Technology, Inc. and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.
Packaging
OMNIVISION Expands TheiaCel Product Portfolio with New 12MP-resolution Image Sensor
OMNIVISION today debuted its OX12A10 12-megapixel (MP)-resolution CMOS image sensor with TheiaCel technology at AutoSens Europe 2024.
RTX to Develop Ultra-Wide Bandgap Semiconductors for DARPA
New class of materials offer improved conductivity and thermal management properties.
Rapidus Establishes Back-End Semiconductor Manufacturing Process Research-and-Development Center
Rapidus Corporation, a company involved in the research, development, design, manufacture and sales of advanced logic semiconductors, today announced that it will set up a clean room within Seiko Epson Corporation’s facility in Chitose, Hokkaido, and open a research-and-development (R&D) center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
Jabil Acquires Mikros Technologies
Jabil Inc. today announced the successful acquisition of Mikros Technologies LLC, a leader in the engineering and manufacturing of liquid cooling solutions for thermal management, completed October 1.
Empower Debuts Revolutionary AI Power Delivery Platform to Solve Critical Technology Roadblock
Empower Semiconductor today unveiled the Crescendo vertical power delivery platform to address the growing power demands of artificial intelligence (AI) and high-performance computing (HPC) applications.
Georgia Tech to Use ClassOne Technology Solstice S8 Single-Wafer Wet Processing System for Advanced Packaging R&D
ClassOne to support establishment of 3D heterogeneous integration hub at Georgia Tech’s Institute for Matter and Systems
Sivers Semiconductors Receives CHIPS Act Funding Award from NEMC Hub
$6M award accelerates lab-to-fab development of critical chip technology.
Natcast Launches National Semiconductor Technology Center Membership Program
Public-private consortium will focus on innovation, collaboration, and education to bolster the U.S. semiconductor industry…
SK hynix Begins Volume Production of the World’s First 12-Layer HBM3E
SK hynix Inc. announced today that it has begun mass production of the world’s first 12-layer HBM3E product with 36GB, the largest capacity of existing HBM to date.
