M31 Technology Corporation announced a collaboration with Tower Semiconductor yielding the successful development of static random access memory (SRAM) and read-only memory (ROM) IP products using a 65nm process.
Packaging
Tablet Market Finally Moves Past the Pandemic Era with Solid Growth in Q2 2024
Worldwide tablet shipments recorded year-over-year growth of 22.1% in the second quarter of 2024 (2Q24), totaling 34.4 million units, according to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.
Kioxia Announces Completion of New Flash Memory Manufacturing Building in Kitakami Plant
Kioxia Corporation today announced that the building construction of Fab2 (K2) of its Kitakami Plant was completed in July.
Lam Research Introduces Lam Cryo 3.0 Cryogenic Etch Technology
Production-proven innovation addresses critical manufacturing challenges as memory makers target 1,000-layer 3D NAND by decade end.
JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages
JEDEC Solid State Technology Association today announced that its JC-15 Committee for Thermal Characterization Techniques for Semiconductor Packages welcomes interested companies to join JEDEC and participate in committee meetings and activities.
SIA Urges Senate Passage of Tax Relief for American Families and Workers Act
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer, urging Senate approval of the House-passed Tax Relief for American Families and Workers Act (H.R. 7024).
JEOL Releases New Schottky Field Emission Scanning Electron Microscope
JEOL Ltd. announced the release of the new Schottky Field Emission Scanning Electron Microscope JSM-IT810 on July 28, 2024.
Alphawave Semi Launches Industry’s First 3nm UCIe IP with TSMC CoWoS Packaging
Alphawave Semi has launched the industry’s first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.
Nordson Electronics Solutions Completes its Europe Location Move to a New Facility
Nordson Electronics Solutions announced that their Nordson B.V. division, which covers Europe, the Middle East, and Africa, has consolidated its offices into one site in Valkenswaard, The Netherlands, in early July.
Micron Announces Volume Production of Ninth-Generation NAND Flash Technology
Micron Technology, Inc. announced today that it is shipping ninth-generation (G9) TLC NAND in SSDs, making it the first in the industry to achieve this milestone.
