With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology.
Packaging
Nordson’s Semiconductor Advanced Packaging Solutions Will Be Demonstrated at SEMICON Taiwan 2023
Nordson Electronics Solutions will demonstrate the latest solutions for semiconductor advanced packaging at the SEMICON Taiwan tradeshow booth L0800, Hall 1, 4th floor.
TSMC to Build Multi-Billion-Euro Chip Factory in Germany
Taiwanese semiconductor manufacturer TSMC plans to construct a massive new production facility in the eastern German city of Dresden.
NEO Semiconductor 3D X-DRAM Awarded “Best of Show” for Most Innovative Memory Technology
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash and DRAM memory, today announced that its ground-breaking technology, 3D X-DRAM, captured the top prize at Flash Memory Summit 2023, winning the “Best of Show” award for the Most Innovative Memory Technology.
Intel Federal, Qorvo, Ayar Labs, and Lockheed Martin ATL Win Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output (KANAGAWA) Prototype Project
The Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) OTA announced Ayar Labs, Intel, Lockheed Martin ATL, and Qorvo are the prime awardees of the Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output (KANAGAWA) prototype project.
SK hynix Showcases Samples of World’s First 321-Layer NAND
SK hynix Inc. showcased today the sample of the 321-layer 4D NAND, making public the progress on its development of the industry’s first NAND with more than 300 layers.
SMC 2023 Keynotes and Sessions: Paving the Way to the Next Semiconductor Industry Super Cycle
With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2023) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials October 2-4, 2023 at the Holiday Inn in San Jose, Calif.
Allegro MicroSystems to Acquire Crocus Technology to Accelerate Innovation in TMR Sensing Technology
Allegro MicroSystems, Inc. today announced that it has signed a definitive agreement to acquire Crocus Technology (“Crocus”) for $420 million in cash.
Global Semiconductor Sales Increase 4.7% in Q2 Compared to Q1
Q2 sales down 17.3% compared to Q2 2022; worldwide sales in June increase 1.7% month-to-month.
Micron Launches Memory Expansion Module Portfolio to Accelerate CXL 2.0 Adoption
Micron Technology, Inc., today announced sample availability of the Micron CZ120 memory expansion modules to customers and partners. The Micron CZ120 modules come in 128GB and 256GB capacities in the E3.S 2T form factor, which uses PCIe Gen5 x8 interface.
