Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
Packaging
Entegris Breaks Ground for Manufacturing Center of Excellence in Colorado Springs
Entegris, Inc. today held a groundbreaking ceremony for its new manufacturing center of excellence in Colorado Springs, Colorado.
U.S. Department of Commerce Announces CHIPS for America R&D Leaders
CHIPS for America was established by historic legislation to bring semiconductor manufacturing back to the U.S. and to solidify the country’s leadership in technology and innovation.
Analog Devices Appoints Stephen Jennings to its Board of Directors
Analog Devices, Inc. today announced that its Board of Directors has appointed Stephen Jennings as an independent director and member of the Board’s Compensation and Talent Committee effective as of June 4, 2023.
Microchip Slashes Time to Innovation with Industry’s Most Power-Efficient Mid-Range FPGA Industrial Edge Stack
Additions make it easier than ever to switch to PolarFire FPGAs and System-on-Chip (SoC) FPGAs.
Renesas Completes Acquisition of Panthronics
Renesas Electronics Corporation today announced its successful completion of acquiring Panthronics AG.
Pfeiffer Vacuum Plans to Invest €75M in its Annecy Location in France
Pfeiffer Vacuum Technology AG announced a seven-year, €75 million investment plan for its Annecy site at the “Choose France” summit for foreign investors.
ROHM’s New Class-Leading Low ON Resistance N-Channel MOSFETs
ROHM Semiconductor today announced the RS6xxxxBx / RH6xxxxBx series of N-channel MOSFETs (40V/60V/80V/100V/150V; 13 part numbers) suitable for applications operating on 24V/36V/48V power supplies, such as base stations, servers, and motors for industrial and consumer equipment.
CEA-Leti Proof of Concept Demonstrates Electrons Move Faster in Germanium Tin Than in Silicon or Germanium
CEA-Leti research scientists have demonstrated that electrons and other charge carriers can move faster in germanium tin than in silicon or germanium, enabling lower operation voltages and smaller footprints in vertical than in planar devices.
Semtech Announces New President and CEO
Semtech Corporation today announced that its board of directors has appointed Paul H. Pickle as Semtech’s new president and chief executive officer.
