esmo group (esmo) announced the launch of its latest innovation, lykos, a modular Burn-in Board (BIB) loading and unloading system designed to eliminate manual placement and orientation errors.
Packaging
Sivers Photonics Receives $1.3M Order from US Company for Custom Photonic Device Qualification
Sivers Semiconductors AB today announced that its subsidiary, Sivers Photonics, has received a new order worth $1.3M (approx. MSEK 14) for the qualification and supply of advanced photonic devices for optical sensing applications from a US-based customer.
Heraeus Electronics to Showcase Cutting-Edge Semiconductor Packaging Materials and Printed Electronics at SEMICON West
Heraeus Electronics announced its participation in SEMICON West, one of the most prominent global exhibitions for the semiconductor industry.
Highlight Tech Corp. (HTC) Announces Entry into US Market to Address Rapid Semiconductor Fab Growth
HTC, a Taiwan-based company and manufacturer of specialty process components, systems, and services for highly complex semiconductor manufacturing operations, today announced its expansion into the U.S. with the opening of a new North American headquarters, ‘HTC-America,’ strategically based in Phoenix.
Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security
Collaboration will boost U.S. semiconductor supply chain for mission-critical security systems, in support of the CHIPS and Science Act.
Novel Ferroelectrics for More Efficient Microelectronics
A team of researchers from Carnegie Mellon University and Penn State University is exploring novel materials that have potential to make microelectronics more energy efficient.
Bosch Rexroth Announces Departure of President and CEO, Gregory Gumbs
Bosch Rexroth announced its President and Chief Executive Officer Gregory Gumbs will leave the company July 1, 2023.
Micron Announces High-Capacity, High-Performance RDIMM Memory Solutions
Micron Technology, Inc. today announced volume production availability of high-capacity 96GB DDR5 RDIMMs in speeds up to 4800MT/s, which have double the bandwidth compared to DDR4 memory.
SK hynix Begins Mass Production of Industry’s Highest 238-Layer 4D NAND
SK hynix Inc. announced today that it has started mass production of its 238-layer 4D NAND Flash memory, following the development in August 2022, and that product compatibility test with a global smartphone manufacturer is underway.
Global Semiconductor Sales Increase 0.3% Month-to-Month in April
Worldwide chip sales down 21.6% year-to-year; latest industry forecast projects annual downturn of 10.3% in 2023 followed by growth of 11.9% in 2024.
