NXP Semiconductors today announced its collaboration with TSMC to deliver the industry’s first automotive embedded MRAM in 16nm FinFET technology.
Packaging
GlobalFoundries, Samsung Electronics, and TSMC Join Imec’s “Sustainable Semiconductor Technologies & Systems” (SSTS) Program
In response to mounting concerns about climate change, tech companies around the world are accelerating the efforts to complete carbon neutrality for their supply chains and products.
Intel Surpasses First 2030 Goal: $2 Billion in Diverse Supplier Spending
Early success boosts Intel’s commitment to strengthening supplier diversity in the semiconductor ecosystem.
Littelfuse Appoints Dr. Greg Henderson to Board of Directors
Littelfuse, Inc. announced today the appointment of Dr. Greg Henderson to the company’s board of directors, effective May 15, 2023.
Advanced Semiconductor Packaging Technologies: The Development Trend and the Growth Drivers, IDTechEx Reports
Advanced semiconductor packaging technologies are crucial due to the slowing of Moore’s law and rising costs of monolithic Si IC development and manufacturing.
Samsung Develops Industry’s First CXL DRAM Supporting CXL 2.0
Samsung Electronics Co. Ltd. today announced its development of the industry’s first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Samsung worked closely with Intel on this landmark advancement on an Intel Xeon platform.
Entegris Opens Manufacturing Facility in Kaohsiung, Taiwan
The 54,000-square-meter facility will be Entegris’ largest manufacturing facility producing solutions critical to chipmakers.
IMAPS & IPC to Host On-Shoring Workshop July 10-12, 2023 in Washington, DC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, July 10-12, 2023, in Washington, DC.
Silicon Catalyst Announces “Silicon Startups Contest” in Partnership with Arm
Worldwide call for applicants to qualify and win significant commercial and technical support from Arm.
Fujifilm to Acquire Semiconductor High Purity Process Chemicals Business from Entegris for $700 Million
FUJIFILM Corporation today announced that the company has entered into a definitive agreement to acquire the semiconductor high purity process chemicals (HPPC) business, CMC Materials KMG Corporation (KMG), from the US-based Entegris, Inc. for $700 million.
