STMicroelectronics announces an advanced process based on 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded phase change memory (ePCM) to support next-generation embedded processing devices.
Packaging
ASU and Deca Technologies to Launch R&D Center for Advanced Fan-Out Wafer-Level Packaging
Advanced packaging advances next wave of innovation in global chips manufacturing.
TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
NVIDIA today announced that TSMC and Synopsys are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC, the global association for electronics manufacturing, as its chief strategist for advanced packaging.
UMass Amherst Researchers Join $26M Quantum Computing Effort to Build Internet of the Future
UMass is leading the core effort to design architectures and protocols for quantum networking for the National Science Foundation’s Center for Quantum Networks.
Weebit Nano to Demo its ReRAM Technology on GlobalFoundries’ 22FDX Platform
Weebit Nano Limited will showcase a live demo of Resistive Random-Access Memory (ReRAM) technology implemented in GlobalFoundries’ 22FDX platform.
HiPace 30 Neo: Smallest Hybrid-Bearing High-Power Turbopump on the Market
The new HiPace 30 Neo turbopump from Pfeiffer Vacuum is a vacuum pump for compact analysis systems and portable applications.
Semiconductor Assembly and Test Facility Database Now Tracks OSAT and Integrated Device Manufacturers in 670 Facilities
New edition of SEMI’s database tracks 33% more facilities and highlights advanced packaging and factory certifications.
Toray Develops Hybrid Bonding Resin for Enhancing Yield and Reliability in Semiconductor Packaging
Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding).
Adeia Chooses Veeco to Accelerate Next-Generation Advanced Packaging Applications
Veeco Instruments Inc. today announced that Adeia Inc., a semiconductor R&D innovator has chosen the WaferStorm Wet Processing Systems for advanced packaging applications.
