The shipment went to a leading semiconductor device maker located in North America.
Packaging
SEMIFIVE Achieves Mass Production Milestone of its SoC Platform
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, announced it has begun mass production of its first SoC Platform-based AI chip product built on Samsung Foundry’s matured 14nm FinFET technology.
Kyocera to Acquire Construction Site in Japan for New Smart Factory
Kyocera Corporation today announced that it has reached an agreement to acquire about 37 acres of land for a new smart factory at the Minami Isahaya Industrial Park in Isahaya City, Nagasaki Prefecture.
FLEX Conference 2023 to Spotlight Latest Flexible Hybrid Electronics, Printed Electronics and Advanced Packaging Innovations
FLEX Conference will gather industry experts July 11-13, 2023, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible hybrid electronics (FHE), printed electronics and advanced packaging including heterogeneous integration.
Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon’s High-Performance Processors
VeriSilicon today announced Blue Ocean Smart System, an AI chiplet and SoC design company, has deployed high-performance AI chips with scalable chiplet architecture powered by multiple processors from VeriSilicon
Semiconductor Research Corporation announces 2023 Call for Research, $16.5M in Funding Opportunities
Semiconductor Research Corporation (SRC) is announcing the launch of solicitation season. Calls for research will begin in early April and will run through May.
Kioxia and Western Digital Announce Newest 3D Flash Memory
Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology.
JCET Accelerates Technology Upgrades and Transformation in 2022
JCET Group, a global provider of integrated circuit (IC) manufacturing and technology services, today announced its full year financial results for the year ended December 31, 2022.
Georgia Tech and GlobalFoundries to Collaborate on Joint Semiconductor Research and Workforce Development
New partnership to include educational opportunities for Georgia Tech students and faculty, STEM outreach, and joint R&D programs on GF technology.
Global Wafer Level Optics Market to Reach US$ 24,908M by 2031 at Staggering CAGR of 51.07%
Additionally, the market is also expected to see a growth in volume, with a CAGR of 50.68% during the same period.
