TECHCET forecasts a rebound in the global semiconductor materials market this year.
Packaging
Adeia Presents Metrology Techniques for Improved Yield in Hybrid Bonding at IMAPS Device Packaging Conference 2024
Adeia Inc. will showcase the latest developments in hybrid bonding technology at the 20th Annual Device Packaging Conference (DPC 2024) on March 18-21, 2024, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
Brooks Instrument Introduces New Mass Flow Controllers for High-Temperature Environments
Brooks Instrument has released its new GF120xHT Series high-temperature thermal mass flow controller.
Silicon Box Announces $3.6B Investment For Expansion Into Italy
Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility.
MRSI Introduces MRSI-A-L Active Aligner
MRSI Systems (a part of Mycronic Group), a manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, introduced the MRSI-A-L Active Aligner.
TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms
Contributing to technical innovation in optical and digital devices by solving the need for greater miniaturization and higher density mounting of semiconductors.
President Biden Highlights Importance of Strong U.S. Semiconductor Supply Chains During State of the Union Address
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer regarding President Biden’s State of the Union address.
SkyWater Expands Board of Directors with Appointment of Dennis Goetz and Joseph Humke
SkyWater Technology, the trusted technology realization partner, today announced the appointment of two accomplished professionals to its board of directors: Dennis Goetz and Joseph Humke, effective April 1, 2024.
IDC Forecasts Global PC Shipments to Grow 2.0% in 2024
As the global economy nears recovery, so will the PC market with global shipments forecast to reach 265.4 million units in 2024, up 2.0% from the prior year.
