The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the administration’s launch of over $5 billion in semiconductor R&D investments through the National Semiconductor Technology Center (NSTC), as well as funding for vital semiconductor workforce initiatives and other programs.
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EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure
Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today announced that EdgeQ has deployed Arteris’ FlexNoC network-on-chip (NoC) IP on its revolutionary 5G and AI-driven Base Station-on-a-Chip.
Trangistics Celebrates One Year Of Making History on Record-Setting New Microchip Factory
Trangistics, a logistics partner for high-tech construction projects, celebrates one year of its partnership with general contractor United Integrated Services (UIS) in supporting the construction of a new, $40 billion computer chip manufacturing plant in Arizona.
NY CREATES, Brookhaven National Laboratory, and Rensselaer Polytechnic Institute Announce Partnership
NY CREATES, the U.S. Department of Energy’s (DOE) Brookhaven National Laboratory (BNL), and Rensselaer Polytechnic Institute (RPI) announced they are collaborating to advance Quantum Information Science Engineering and Technology and Microelectronics in New York State and the nation.
Soctera Demonstrates Superior Thermal Performance in GaN HEMTs For Next-Generation Telecommunications and Radar Solutions
Third-party-verified III-Nitride transistors, fabricated on 4-inch wafers produced at IQE, are moving towards commercial production with standard foundry processes.
Flex Logix Joins Intel Foundry Services Accelerator IP Alliance
Flex Logix Technologies, Inc. announced today that it has joined the Intel Foundry Services (IFS) Accelerator IP Alliance.
ASMC 2024 to Spotlight Advanced Semiconductor Manufacturing Innovations and Excellence
The 35th annual ASMC will feature over 30 hours of technical and poster presentations by more than 120 industry experts on the latest manufacturing strategies and methodologies.
With More Than 24,000 Registered, SPIE Photonics West 2024 Showcased a Robust and Expanding Industry
The largest annual optics and photonics event of the year, which includes the rapidly growing Quantum West conference and the co-located SPIE AR|VR|MR, encompassed more than 1,500 exhibitors and over 5,000 technical presentations.
Infineon and Worksport Collaborate to Reduce Weight and Cost of Portable Power Stations with GaN
Infineon Technologies AG has announced a collaboration with Worksport Ltd.
A New “Metal Swap” Method for Creating Lateral Heterostructures of 2D Materials
Researchers employ a new “transmetallation” technique to develop ultrathin electronic devices from 2D coordination nanosheets.
