Rapidus Corporation today announced that its plans and budget for fiscal year 2025 have been approved by Japan’s New Energy and Industrial Technology Development Organization (NEDO).
Packaging
Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
This system is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications.
HieFo Introduces High Efficiency CW Lasers for Silicon Photonics Transceivers
HieFo announced today the product launch of multiple new high-efficiency Continuous Wave DFB indium phosphide (InP) lasers, designed to address the ever-increasing demands of silicon photonics based optical transceivers.
NHanced Semiconductors President Robert Patti to Detail “Foundry 2.0” at SEMIEXPO Heartland
New manufacturing model extends Moore’s Law via advanced packaging, employing a range of 3D IC processes.
GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix Platform
Ansys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.
SEALSQ and IC’ALPS Join Forces to Advance Post-Quantum Secure ASICs for Automotive Functional Safety
SEALSQ Corp. today announces a strategic collaboration with IC’ALPS, a ASIC design house specializing in custom integrated circuits ready for IATF16949 standard, mastering Functional Safety for ISO 26262 with solutions tailored to meet the required ASIL levels.
Automotive Electrification Movement
Whether designing for passenger or commercial vehicles, engineers today must consider numerous complex, power-hungry systems and features that not only meet consumer and commercial demand but are also highly efficient, durable and safe.
Pragmatic Semiconductor Set to Revolutionize NFC Connectivity with Sustainable Flexible Chips
Pragmatic Semiconductor Ltd. today announced the launch of its latest radio frequency identification (RFID) near-field communication (NFC) product line, Pragmatic NFC Connect.
Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels
Toray Engineering Co., Ltd. has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging.
The Shape of Tomorrow’s Semiconductor Technology
The theme of the 70th annual IEEE IEDM was “Shaping Tomorrow’s Semiconductor Technology.” Read about the latest advances in logic, memory, high frequency and power devices, and more.
