Teradyne, Inc. today announced that Shannon Poulin has joined Teradyne to succeed Rick Burns as President of the Semiconductor Test Division in Q2 2025.
Packaging
Infineon Extends MOSFET Portfolio With First P-channel Device
Infineon Technologies AG today announced the addition of P-channel power MOSFETs to its family of radiation-tolerant power MOSFETs for Low-Earth-Orbit (LEO) space applications.
Global Semiconductor Sales Increase 17.9% Year-to-Year in January
Sales hit highest-ever total for month of January; worldwide chip sales decrease 1.7% month-to-month.
Pragmatic Semiconductor Launches Next-Generation Platform for Mixed-Signal Flexible ASIC Design
Pragmatic Semiconductor Ltd. today announced the launch of Pragmatic FlexIC Platform Gen 3, offering a 10x digital power and 3x digital area improvement over the previous generation.
ETH Zurich and Polariton Technologies Achieve Record- Breaking Electro-Optic Bandwidth with Plasmonic Modulators
Polariton Technologies AG, an ETH Zurich spin-off, together with ETH Zurich have set a new benchmark in the field of electro-optic (EO) modulators with their latest innovation.
TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.
Saras Micro Devices Announces Participation in CHIPS National Advanced Packaging Manufacturing Program Initiatives
Saras Micro Devices today announced its participation in two significant projects funded by the U.S. Department of Commerce CHIPS National Advanced Packaging Manufacturing Program (NAPMP).
Semiconductor Climate Consortium Announces Key 2025 Initiatives
The Semiconductor Climate Consortium (SCC) today unveiled its four key initiatives for 2025, marking a significant step forward in advancing the industry’s commitment to decarbonization and transparency.
TSMC Intends to Expand Its Investment in the United States to US$165B
Company plans to increase U.S. investment in advanced semiconductor manufacturing by $100 billion with three new fabs, two advanced packaging facilities and an R&D center added to U.S. plans.
eInfochips Joins Samsung Advanced Foundry Ecosystem
eInfochips, an Arrow Electronics company, announced the company has joined the Samsung Advanced Foundry Ecosystem (SAFE) as a Virtual Design Partner.
