Nordson Electronics Solutions releases the Synchro 3, a new model in the SELECT Synchro selective soldering equipmen family for high-volume printed circuit board assembly applications.
Packaging
Henkel Semiconductor Capillary Underfill Enables AI and Advanced Packaging Designs
Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
NY CREATES and C2MI Announce Partnership
NY CREATES and MiQro Innovation Collaborative Centre – C2MI today announced a partnership between the two entities that will enhance research opportunities, expand potential for economic and workforce development, and nurture collaborative efforts.
Old Crystal, New Story for Enhancing Deep Ultraviolet Laser Performance
In the realm of science and technology, harnessing coherent light sources in the deep ultraviolet (DUV) region holds immense significance across various applications such as lithography, defect inspection, metrology, and spectroscopy.
Microchip Technology Expands Its Serial SRAM Portfolio
To address a common customer need for bigger and faster SRAM, Microchip Technology has expanded its Serial SRAM product line to include larger densities of up to 4 Mb and increased Serial Peripheral Interface/Serial Quad I/O Interface (SPI/SQI) speed to 143 MHz.
Thermal Management Expo Europe Unveils Business Opportunities for High-Tech Industries
The flagship event of the global Thermal Management Expo portfolio, Thermal Management Expo North America is a unique, free-to-attend exhibition and conference that connects senior engineers and key decision-makers with suppliers specializing in thermal systems and materials.
SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform-based Product
This marks SEMIFIVE’s third commercialization of its SoC Platform solutions built on Samsung Foundry’s mass production proven FinFET process technologies.
IDTechEx Explores Technology Trends in Dielectric Materials for Next Generation 2.5D and 3D Semiconductor Packaging
The semiconductor industry continually pushes packaging technology boundaries to meet the demand for higher chip performance and efficiency. Bandwidth is one of the critical factors defining the amount of data transmitted between dies on a package
Lidar Market Size Worth $ 5.16B, Globally, by 2031
The Global Lidar Market is projected to grow at a CAGR of 8.01% from 2024 to 2031, according to a new report published by Verified Market Research.
Wolfspeed Tops Out World’s Largest, Most Advanced Silicon Carbide Facility
Wolfspeed held a ceremony to celebrate the topping out of construction at the $5 billion John Palmour Manufacturing Center for Silicon Carbide.
