In response to news that the Biden administration has directed $6.6 billion in subsidies to Taiwan Semiconductor Manufacturing Co’s (TSMC) Arizona subsidiary, as part of the U.S. CHIPS and Science Act, the American Economic Liberties Project released the following statement.
Packaging
U.S. Department of Commerce Receives Over 160 Concept Plans for CHIPS for America Funding
Projects to play vital role in strengthening the U.S. semiconductor supply chain.
Global Semiconductor Sales Increase 16.3% Year-to-Year in February
Year-to-year market growth in February is largest since May 2022; worldwide chip sales decrease 3.1% month-to-month.
sureCore Announces Low Power Memory Compiler for 16nm FinFET
sureCore, the low power embedded memory specialist, has announced the availability of its PowerMiser, ultra-low, dynamic power memory compiler in 16nm.
Semiconductor Metal Plating Chemicals to Top $1 Billion
TECHCET is forecasting Metal Plating Chemicals to grow 7% in 2024, to reach over $1 billion.
Binghamton University Receives $1M to Support Job Training in Electronics Manufacturing
New cleanroom equipment creates ideal space for students to learn advanced packaging processes.
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
SK hynix Inc. announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Nordson Electronics Solutions Expands the SELECT Synchro Selective Soldering Equipment Family
Nordson Electronics Solutions releases the Synchro 3, a new model in the SELECT Synchro selective soldering equipmen family for high-volume printed circuit board assembly applications.
Henkel Semiconductor Capillary Underfill Enables AI and Advanced Packaging Designs
Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
NY CREATES and C2MI Announce Partnership
NY CREATES and MiQro Innovation Collaborative Centre – C2MI today announced a partnership between the two entities that will enhance research opportunities, expand potential for economic and workforce development, and nurture collaborative efforts.
