Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has completed the first phase of its plan to expand its die bonding services.
Packaging
Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs
Synopsys, Inc. today announced that its longstanding collaboration with Samsung Foundry has produced multiple successful test chip tapeouts on Synopsys digital and custom design tools and flows, certified for Samsung Foundry’s most advanced process.
SEMIFIVE Announces New 5nm HPC SoC Platform
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, today revealed its latest SoC Platform targeting high performance compute (HPC) applications.
Mark Templeton Inducted into Phil Kaufman Hall of Fame by the ESD Alliance and IEEE CEDA
Mark Templeton, the former managing director of investment firm Scientific Ventures, and a Lanza techVentures investment partner and board member, today was inducted posthumously into the Phil Kaufman Hall of Fame.
KLA Announces Plans to Build a New R&D and Manufacturing Facility in Newport, Wales
KLA Corporation has announced plans to build a new research-and-development (R&D) and manufacturing center for the SPTS division, in Newport, Wales, UK.
Industry Well Represented on New U.S. Government Advisory Committee on Microelectronics Industry
Two of the electronics industry’s most far-sighted and innovative leaders have been named to the U.S. Department of Commerce’s new Industrial Advisory Committee (IAC), which will provide guidance to the Secretary of Commerce on a range of issues related to CHIPS for America Act programs.
Discovery of New Nanowire Assembly Process Could Enable More Powerful Computer Chips
In a newly-published study, a team of researchers in Oxford University’s Department of Materials led by Harish Bhaskaran, Professor of Applied Nanomaterials, describe a breakthrough approach to pick up single nanowires from the growth substrate and place them on virtually any platform with sub-micron accuracy.
NAND Flash Prices Expected to Plummet 15-20% in Q4
Utmel, a professional electronic component distributor, informs buyers that NAND flash prices are expected to fall 15-20% in Q4.
Saras Micro Devices Selects Technology Manufacturing Site in Arizona
Saras Micro Devices has selected a site in the Price Corridor in Chandler, AZ to build out a manufacturing facility for its advanced power delivery solutions.
StratEdge Packaging and Assembly Services Expands for High-Frequency and High-Power Devices
Technical experts available at BCICTS 2022 and IMAPS 2022 to discuss packaging applications.
