onsemi today announced a trio of silicon carbide (SiC) based power modules in transfer molded technology that are intended for use in on-board charging and high voltage (HV) DCDC conversion within all types of electric vehicles (xEV).
Packaging
ACM Research Launches New Furnace Tool for Thermal Atomic Layer Deposition to Support Advanced Semiconductor Manufacturing Requirements
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace tool.
Nearly $11M in Addtional DOD Funds Expands Purdue-led Microelectronics Workforce Program
Five-year extension of SCALE workforce initiative aims to restore global lead through education initiatives.
Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022
Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in 2022.
SEMI and AVCC Team to Promote Autonomous Vehicle Innovation and Mass Market Adoption
The Autonomous Vehicle Computing Consortium and SEMI announced today an alliance to drive autonomous vehicle innovation.
New Nanocomposite Films Boost Heat Dissipation in Thin Electronics
Scientists from Japan developed cellulose nanofiber-carbon fiber composite films with high in-plane heat conductivity to assist in heat dissipation.
Siemens Automates 2.5D and 3D IC Design-for-Test with New Tessent Multi-Die Solution
Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
SABIC Names Conventus Polymers as New Distribution Partner for Specialty Thermoplastics in North America
SABIC has named Conventus Polymers, LLC, as an authorized distributor of high-performance engineering thermoplastics in the United States, Canada and Mexico.
Nordson Corporation Appoints Anand Patel as Vice President, Treasury and Finance
Nordson Corporation announced that Anand Patel will succeed Ray Cushing as vice president, treasury and finance following Ray’s upcoming retirement.
Defense Strategies Institute Announces 2022 Assured Microelectronics Summit Agenda
Defense Strategies Institute is pleased to announce the agenda for the 2022 Assured Microelectronics Summit is now available.
