Non-hydrocarbon sourced helium production from new facility contracted on long-term agreement with Air Liquide.
Packaging
Scientists Unravel ‘Hall Effect’ Mystery in Search for Next Generation Memory Storage Devices
An advance in the use of antiferromagnetic materials in memory storage devices has been made by an international team of physicists.
Aehr Receives Production Orders for WaferPak Full Wafer Contactors
These WaferPak Contactors are expected to ship by the end of Aehr’s fiscal third quarter ending February 28, 2023.
Meister Abrasives to Participate for the First Time at the 19th International Conference on Silicon Carbide and Related Materials
Superabrasives leader Meister Abrasives announces its participation in the International Conference on Silicon Carbide and Related Materials (ICSCRM) in September 2022.
Lithium Silicon Battery Market Worth $247M by 2030
Lithium Silicon Battery Market size is projected to grow from USD 10 million in 2022 to USD 247 million by 2030 at CAGR of 48.4% during the forecast period from 2022 to 2030.
Gartner Forecasts Worldwide Semiconductor Revenue Growth to Slow to 7% in 2022
Global semiconductor revenue is projected to grow 7.4% in 2022, down from 2021 growth of 26.3%, according to the latest forecast from Gartner, Inc.
Ferrotec Holds Groundbreaking Ceremony for Its New Factory in Kedah, Malaysia
Ferrotec Holdings Corporation today announced the groundbreaking ceremony to begin construction of its new manufacturing facility at Kulim Hi-Tech Park, Kedah, facilitated by the Malaysian Investment Development Authority (MIDA).
Applied Materials Chief Technology Officer Dr. Om Nalamasu Receives IEEE Frederik Philips Award
Applied Materials, Inc. today announced that Dr. Omkaram (Om) Nalamasu, Senior Vice President and Chief Technology Officer, is the recipient of the 2023 IEEE Frederik Philips Award, which honors outstanding accomplishments in the management of research and development resulting in effective innovation in the electrical and electronics industry.
Advanced Semiconductor Packaging Paves Way to Data-Centric Future, Says IDTechEx
IC vendors have been pushed towards “advanced semiconductor packaging” to meet the world’s data needs.
Mercury Systems Receives $12M Order for Advanced Packaging of GPS Modules
Mercury Systems Inc. announced it received a $12 million order from a leading defense prime contractor to provide advanced trusted and secure manufacturing and packaging for their GPS modules.
