Accellera Systems Initiative (Accellera) announced today that Shalom Bresticker, a longtime friend and contributor to Accellera standards efforts, is honored with the first Distinguished Service Award.
Semiconductors
Scintil Achieves Integration of III-V DFB Lasers and Amplifiers with Standard Silicon Photonics Technology in Production at Tower Semiconductor
This significant milestone is pivotal in reinforcing Scintil’s supply chain and meeting growing demand for high-performance communication solutions in data centers, artificial intelligence (AI) and 5G networks.
Imec Demonstrates Readiness of the High-NA EUV Patterning Ecosystem
Advances in processes, masks and metrology will enable to fully benefit from the resolution gain offered by the first ASML 0.55NA EUV scanner.
Finwave Semiconductor Showcases Breakthrough Performance Advancement with GaN-on-Silicon Technology at MWC Barcelona 2024
Finwave Semiconductor, Inc. is showcasing its latest technology and products this week at MWC Barcelona.
National Institute for Innovation and Technology Hosts Arizona Semiconductor Panel Discussion
Institute’s panel brought together key stakeholders for panel discussion on workforce development in growing semiconductor manufacturing industry, highlights the City of Phoenix’s efforts.
SAPEON Collaborates with DOCOMO Innovations
SAPEON, a global AI semiconductor company, announced their partnership with DOCOMO Innovations, INC. based in Silicon Valley, a subsidiary of Japan’s largest mobile operator, NTT DOCOMO, INC.
Micron Commences Volume Production of Industry-Leading HBM3E Solution to Accelerate the Growth of AI
Micron Technology, Inc. today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution.
U.S. Department of Energy Announces $2.25 Million American-Made SiC Semiconductor Prize Competition
The U.S. Department of Energy’s (DOE) Office of Electricity (OE) today launched the American-Made Silicon Carbide (SiC) Semiconductor Packaging Prize.
Applied Materials Expands Patterning Solutions Portfolio for Angstrom Era Chipmaking
Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to address the patterning requirements of chips in the “angstrom era.”
TSMC’s Kumamoto Plant (JASM) Grand Opening on 24th February
TrendForce’s latest report reveals that in 2023, global foundry revenues hit US$117.47 billion, with TSMC capturing a dominant 60% share.
