TECHCET, the electronic materials advisory firm providing business and technology information, held its highly successful and well-attended 2022 Critical Materials Conference in Chandler, Arizona on April 28th and 29th.
Semiconductors
ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems
10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications.
Steven Laub Joins Rambus Board of Directors
Rambus Inc., a chip and silicon IP provider making data faster and safer, today announced the appointment of Steven Laub to its Board of Directors.
Infineon Moves Austin Production Site to Renewable Power
Infineon Technologies AG today announced that it has switched the operation of its Austin, Texas semiconductor factory, also known as “Fab25,” to 100 percent renewable power.
SIA, FIRST Announce Partnership to Strengthen U.S. STEM Workforce
Partnership will focus on enhancing talent pipeline to equip students with skills needed for science and technology careers.
A New Age of 2.5D Materials
2.5-dimensional materials promise new applications for artificial intelligence, electronics, automobiles and the energy sector.
ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems
ACM Research, Inc. today announced that a volume purchase contract has been received from a leading Chinese OSAT for 10 Ultra ECP ap high-speed plating tools, which are scheduled to be delivered later in 2022 and 2023.
Industry R&D Spending To Rise 9% After Hitting Record in 2021
New update shows Intel continues to lead research and development ranking, the top 10 raised spending 18% last year, and 21 companies invested $1 billion or more on R&D in 2021.
MaxLinear to Acquire Silicon Motion
Business combination roughly doubles MaxLinear’s total addressable market opportunity to $15 billion and creates a top-ten fabless semiconductor supplier.
New Shape Memory Alloy Discovered Through Artificial Intelligence Framework
Funded by the National Science Foundation’s Designing Materials to Revolutionize Our Engineering Future (DMREF) Program, researchers from the Department of Materials Science and Engineering at Texas A&M University used an Artificial Intelligence Materials Selection framework (AIMS) to discover a new shape memory alloy.
