Samsung Electronics Co., Ltd. and Red Hat, Inc. today announced a broad collaboration on software technologies for next-generation memory solutions.
Semiconductors
Argonne Scientists Use Quantum Computers to Simulate Quantum Materials
Scientists achieve important milestone in making quantum computing more effective.
Diamondx Selected for Internet of Things Semiconductor Test
Cohu, Inc. today announced a U.S. semiconductor manufacturer has selected the Diamondxplatform for testing their product portfolio.
GS Microelectronics (GSME) Enters Market as Globally Focused Outsourced Semiconductor Manufacturing and Operations Solutions Provider
GS Microelectronics, Inc. today announced its official launch as a global provider of Outsourced Semiconductor Manufacturing and Operations (OSeMO) services.
Showa Denko’s Program to Develop 8-inch SiC Wafers for Next-generation Green Power Semiconductor Selected for NEDO’s Green Innovation Fund Projects
Showa Denko proposed its “Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors” to New Energy and Industrial Technology Development Organization (NEDO) as a candidate for “Projects to Develop Wafers Technology for Next-generation Power Semiconductors” which was set as a research and development target of “Next-generation Digital Infrastructure Construction” in “Green Innovation Fund Projects”.
Enhancing Performance, Quality and Yield in Current and Emerging Display Technologies
Process metrology, failure analysis, and core-structure characterization can be invaluable in accelerating research and development, enhancing yield and improving display quality.
China-Based IC Production to Represent 21.2% of China IC Market in 2026
Foreign companies (e.g., Samsung, SK Hynix, TSMC, etc.) are expected continue to comprise more than 50% of IC production in China through 2026.
CMP Consumables – Supply is Tight and Costs Expected to Rise
TECHCET announced the Chemical Mechanical Planarization (CMP) consumables market for semiconductors grew almost 13% in 2021 to reach US$3.0 billion.
Texas Instruments Breaks Ground on New 300mm Semiconductor Wafer Fabrication Plant in Sherman, Texas
Texas Instruments this week broke ground on its new 300mm semiconductor wafer fabrication plants (or “fabs”) in Sherman, Texas.
Heraeus Electronics Announces Global Launch of Condura.ultra Ag Si3N4 free AMB Substrate at PCIM Europe
Heraeus Electronics this week announced the launch of its new Condura.ultra Ag free AMB Substrate.
