It is a milestone on the path to the chip factory of the future: at the new Bosch semiconductor fab in Dresden, silicon wafers are passing through the fully automated fabrication process for the first time.
Semiconductors
Revenue per Wafer Climbs as Demand Surges for 5nm/7nm IC Processes
Despite high development costs, smaller nodes bring greater revenue per wafer.
Heat-Free Optical Switch Would Enable Optical Quantum Computing Chips
In a potential boost for quantum computing and communication, a European research collaboration reported a new method of controlling and manipulating single photons without generating heat. The solution makes it possible to integrate optical switches and single-photon detectors in a single chip.
Teledyne e2v HiRel and Integra Technologies Inc. Partner on High Voltage GaN Devices
Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra).
Global Semiconductor Sales Increase 13.2% Year-to-Year in January
Month-to-month sales tick up 1.0% worldwide during first month of 2021.
Engineering the Boundary Between 2D and 3D Materials
Cutting-edge microscope helps reveal ways to control the electronic properties of atomically thin materials.
SMART Global Holdings Completes the Acquisition of Cree LED
SMART Global Holdings, Inc., today announced that it has completed its acquisition of Cree, Inc.’s Cree LED Products business unit.
Pumping Perovskites Into A Semiconductor Platform
Materials called perovskites can be more readily incorporated into silicon-based semiconducting platforms by using a microfluidic pumping technology developed at KAUST.
SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for HPC Applications
SiPearl, the company designing the high-performance, energy-efficient microprocessor for the European exascale supercomputer and Open-Silicon Research, the India based entity of OpenFive, a leading provider of custom silicon solutions with differentiated IP, today announced a multi-year joint collaboration to enable expansive development of innovative High Performance Computing (HPC) applications.
The 2021 IEEE International Reliability Physics Symposium Will be Presented as a Virtual Conference
The 2021 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, will be held as a virtual conference due to concerns over the global coronavirus (COVID-19) pandemic.
