Georgia Institute of Technology has been selected as a key collaborator in producing a roadmap for the future of advanced packaging for next generation microelectronics.
The U.S. Department of Commerce’s National Institute of Standards and Technology’s (NIST) Office of Advance Manufacturing has selected Semiconductor Research Corporation (SRC) to define, through broad community engagement, the future technical goals of the microelectronics industry and determine how they will be achieved. In collaboration with SRC, Georgia Tech will play a critical role in the governance of this road mapping effort as well as serve as a lead contributor.
“We are delighted to have Georgia Tech serve as an integral contributor of this effort”, said Madhavan Swaminathan, Executive Director, 3D Systems Packaging Research Center. “Our work will be essential in providing the gateway for regaining U.S. manufacturing leadership in advanced packaging, as we leverage our expertise in 3D Microsystems to enable future heterogeneous information, communication, and other disparate devices integrated into a single system that provides pathways for trusted microelectronics.”
