IBM and Samsung Unveil Semiconductor Breakthrough That Defies Conventional Design

Featured Products

Comments (1)
  1. Bessel Func says:

    Getting the top silicon layer to be of high purity crystalline is the key to the process. STI is well established and BEOL metallization should be fairly straight forward. Interested in the current density in the interconnect and its reliability. The techinque should allow a few more nodes of advancement.